Development of a novel non-contact inspection technique to detect micro cracks under the surface of a glass substrate by thermal stress-induced light scattering method

2017 ◽  
Vol 90 ◽  
pp. 80-83 ◽  
Author(s):  
Yoshitaro Sakata ◽  
Nao Terasaki ◽  
Kazuhiro Nonaka
Author(s):  
Yoshitaro Sakata ◽  
Nao TERASAKI

Abstract Demand for flexible electronics is increasing due to recent global movements related to IoT. In particular, the ultra-thin glass substrate can be bent, its use is expanding for various applications such as thin liquid crystal panels. On the other hand, fine-polishing techniques such as chemical mechanical polishing treatments, are important techniques in glass substrate manufacturing. However, these techniques may cause microcracks under the surface of glass substrates because they use mechanical friction. We propose a novel non-contact thermal stress-induced light-scattering method (N-SILSM) using a heating device for inspecting surfaces to detect polishing-induced microcracks. In this report, we carry out the selective detection of microcracks and tiny particles using a N-SILSM with temperature variation. Our results show that microcracks and tiny particles can be distinguished and measured by a N-SILSM utilizing temperature change, and that microcrack size can be estimated based on the change in light-scattering intensity.


1970 ◽  
Vol 14 (2) ◽  
pp. 161-169 ◽  
Author(s):  
W.H. Dalzell ◽  
G.C. Williams ◽  
H.C. Hottel

2001 ◽  
Vol 101 (3) ◽  
pp. 109-118 ◽  
Author(s):  
Ichiro Kajiwara ◽  
Hisao Ogawa ◽  
Hirofumi Soejima ◽  
Keiji Takazoe ◽  
Shinzo Miyamoto ◽  
...  

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