Thermal response of wall implanted with heat pipes: Experimental analysis

2019 ◽  
Vol 143 ◽  
pp. 1687-1697
Author(s):  
Chang Liu ◽  
Zhigang Zhang
Keyword(s):  
Experimental Analysis ◽  
Thermal Response ◽  
Heat Pipes

scholarly journals High Temperature Exposure of HPC – Experimental Analysis of Residual Properties and Thermal Response

2016 ◽  
Vol 63 ◽  
pp. 01004 ◽  
Author(s):  
Zbyšek Pavlík ◽  
Jan Fořt ◽  
Milena Pavlíková ◽  
Jaroslav Pokorný ◽  
Anton Trník ◽  
...  
Keyword(s):  
High Temperature ◽  
Experimental Analysis ◽  
Thermal Response ◽  
High Temperature Exposure ◽  
Residual Properties ◽  
Temperature Exposure

scholarly journals Clearing a Path for Ground Heat Exchange Systems: A Review on Thermal Response Test (TRT) Methods and a Geotechnical Routine Test for Estimating Soil Thermal Properties

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2965 ◽  
Author(s):  
Alessandro Franco ◽  
Paolo Conti
Keyword(s):  
Experimental Analysis ◽  
Thermal Response ◽  
Ground Level ◽  
Thermal Response Test ◽  
Response Test ◽  
Foundation Base ◽  
Definition Of ◽  
Geotechnical Tests

The performance of ground heat exchanger systems depends on the knowledge of the thermal parameters of the ground, such as thermal conductivity, capacity, and diffusivity. The knowledge of these parameters often requires quite accurate experimental analysis, known as a thermal response test (TRT). In this paper, after a general analysis of the various available types of TRT and a study of the theoretical basics of the method, we explore the perspective of the definition of a simplified routine method of analysis based on the combination of a particular version of TRT and the routine geotechnical tests for the characterization of soil stratigraphy and the ground characteristics. Geotechnical analyses are indeed mandatory before the construction of new buildings, even if limited to 30 m below the ground level or foundation base when piles are needed. The idea of developing TRT in connection with geotechnical test activity has the objective of promoting the widespread use of in situ experimental analysis and reducing TRT costs and time. The considerations presented in the present paper lead to reconsidering a particular variety of the TRT, in particular, the versions known as thermal response test while drilling (TRTWD) and TRT using heating cables (HC-TRT).

scholarly journals A Review On Transient Thermal Management of Electronic Devices

2021 ◽  
Author(s):  
John Mathew ◽  
Shankar Krishnan
Keyword(s):  
Thermal Management ◽  
Laser Diode ◽  
High Power ◽  
Electronic Devices ◽  
Thermal Response ◽  
Heat Pipes ◽  
Design Guidelines ◽  
Thermal Design ◽  
Laser Diode Arrays ◽  
Transient Thermal

Abstract Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

Experimental analysis on the loop heat pipes with different microchannel evaporators

2020 ◽  
Vol 178 ◽  
pp. 115547
Author(s):  
Ying Zhang ◽  
Zhen Xia ◽  
Benzhe Song ◽  
Meng Xu ◽  
Yuan Tian ◽  
...  
Keyword(s):  
Experimental Analysis ◽  
Heat Pipes ◽  
Loop Heat Pipes

scholarly journals Application of Additively Manufactured Pentamode Metamaterials in Sodium/Inconel 718 Heat Pipes

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3016
Author(s):  
Longfei Hu ◽  
Ketian Shi ◽  
Xiaoguang Luo ◽  
Jijun Yu ◽  
Bangcheng Ai ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Alkali Metal ◽  
Inconel 718 ◽  
Thermal Stresses ◽  
Engineering Application ◽  
Thermal Response ◽  
Heat Pipes ◽  
Uniform Temperature ◽  
Temperature Distributions ◽  
Stress Accommodation

In this study, pentamode metamaterials were proposed for thermal stress accommodation of alkali metal heat pipes. Sodium/Inconel 718 heat pipes with and without pentamode metamaterial reinforcement were designed and fabricated. Then, these heat pipes were characterized by startup tests and thermal response simulations. It was found that pentamode metamaterial reinforcement did not affect the startup properties of sodium/Inconel 718 heat pipes. At 650–950 °C heating, there was a successful startup of heat pipes with and without pentamode metamaterial reinforcement, displaying uniform temperature distributions. A further simulation indicated that pentamode metamaterials could accommodate thermal stresses in sodium/Inconel 718 heat pipes. With pentamode metamaterial reinforcement, stresses in the heat pipes decreased from 12.9–62.1 to 10.2–52.4 MPa. As a result, sodium/Inconel 718 heat pipes could be used more confidently. This work was instructive for the engineering application of alkali metal heat pipes.

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