2D tape placement machine

In this study, a thermodynamic model of a laser-assisted automated thermoplastic fiber placement process is developed and validated. The main focus is on modeling the heat transfer into the composite with a laser heat source, the thermal properties of the tape, and the resulting heat distribution in the part, the mold, and the compaction roller. A new integrated analytical method is presented to calculate the energy input of the laser based on the geometric boundary conditions, including first-order reflection and laser shadow. The carbon fiber/polyethersulphone tape is modeled by combining literature properties of carbon fiber and matrix as well as based on experimental data of the tape itself. Also a thermal contact resistance between the tape layers is modeled based on a literature model and own experimental measurements. The created model is discretized and implemented in a 2-D finite difference code. With the help of this simulation, the temperature distribution is calculated during layup. The influence of a possible thermal contact resistance between the composite layers is investigated. Furthermore, an experiment with a thermoplastic fiber placement machine from Advanced Fibre Placement Technology GmbH (AFPT) was conducted in order to evaluate the simulation. The simulation and the experiment show a good agreement and prove that thermal contact resistance between the layers is negligible for the investigation process.

Download Full-text

Component Allocation and Partitioning for a Dual Delivery Placement Machine

Operations Research ◽

10.1287/opre.36.2.176 ◽

1988 ◽

Vol 36 (2) ◽

pp. 176-191 ◽

Cited By ~ 64

Author(s):

Javad Ahmadi ◽

Stephen Grotzinger ◽

Dennis Johnson

Keyword(s):

Component Allocation ◽

Placement Machine

Download Full-text

A feeder replenishment policy for a turret-head placement machine

International Journal of Production Research ◽

10.1080/00207540600674499 ◽

2007 ◽

Vol 45 (8) ◽

pp. 1861-1879

Author(s):

Jorge F. Valenzuela ◽

Govindaraj Ramasamy ◽

Harish-krishna Ramaswamy

Keyword(s):

Replenishment Policy ◽

Placement Machine

Download Full-text

A MCVRP-based model for PCB assembly optimisation on the beam-type placement machine

International Journal of Production Research ◽

10.1080/00207543.2018.1555380 ◽

2018 ◽

Vol 57 (18) ◽

pp. 5874-5891 ◽

Cited By ~ 4

Author(s):

Shujuan Guo ◽

Fei Geng ◽

Katsuhiko Takahashi ◽

Xiaohan Wang ◽

Zhihong Jin

Keyword(s):

Pcb Assembly ◽

Beam Type ◽

Placement Machine

Download Full-text

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

Journal of Electronic Packaging ◽

10.1115/1.2905699 ◽

1994 ◽

Vol 116 (4) ◽

pp. 282-289 ◽

Cited By ~ 3

Author(s):

Yu-Wen Huang ◽

K. Srihari ◽

Jim Adriance ◽

George Westby

Keyword(s):

Printed Circuit Boards ◽

Solution Method ◽

Identification Problem ◽

Circuit Boards ◽

Surface Mount ◽

Printed Circuit ◽

Knowledge Based ◽

Sequence Identification ◽

Placement Machine ◽

Solution Methodology

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

Download Full-text

Optimization of Multiple Head SMT Placement Machine: Model and Approaches

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology ◽

10.1115/imece2002-39500 ◽

2002 ◽

Author(s):

Youjiao Zeng ◽

Junqi Yan ◽

Ye Jin ◽

Tao Jiang

Keyword(s):

Printed Circuit Board ◽

Travelling Salesman Problem ◽

Minimum Weight ◽

Optimal Solution ◽

Circuit Board ◽

Matching Problem ◽

Machine Model ◽

Head Surface ◽

Pick And Place ◽

Placement Machine

In order to maximize the throughput rate of single multiple head surface mounted technology placement machine, the time taken for pick-and-place of components for each printed circuit board has to be minimized. This gives rise to two related essential problems, namely feeder assignment problem and pick-and-place sequence determination problem. In this paper, we introduce a model that simplifies problems. We regard all components during a pick-and-place cycle as a unit and give it a matching weight. In this way, we change multiple head machine problems into single head machine problems. The optimisation problem becomes two sub-problems: minimum weight matching problem and travelling salesman problem of these units. We presented algorithms to obtain near optimal solution and implement them as a computer program. We performed experiment on a real four head placement machine. The experimental results are presented to analyse their performance.

Download Full-text

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology ◽

10.1115/imece2002-39252 ◽

2002 ◽

Author(s):

Muthiah Venkateswaran ◽

Peter Borgesen ◽

K. Srihari

Keyword(s):

High Speed ◽

Flip Chip ◽

Printed Circuit Board ◽

Critical Evaluation ◽

Conductive Adhesive ◽

Circuit Board ◽

Lead Free ◽

Conductive Adhesives ◽

Flip Chip Assembly ◽

Placement Machine

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

Download Full-text