Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites

The performance of the micro-chip is affected by overheating and hence reduces the efficiency of electronic devices. The development of high thermal conductivity material can solve problems associated with dissipation of heat from the micro-chips. Thermal conductivity for carbon nanotubes (CNTs) are in the ranges of 1200-3000 W/moK which considered as the best candidate material for heat sink applications. This research investigates the fabrication of CNTs reinforced copper composites using powder metallurgy method. Copper powder and CNTs were ball milled to prepare mixtures and compacted at 600 MPa to fabricate test samples. The compacted test samples were sintered in argon atmosphere at 850oC. Sintered density of CNTs/Cu composites was measured and compared with theoretical density. Density data showed that 98% sintered density was achieved. Optical and scanning electron microscopic (SEM) examination of sintered compacts showed good grain growth, however porosity was also noted in sintered samples. Field emission scanning electron microscopy (FESEM) showed well dispersion of CNTs in copper matrix and interfacial bonding between copper particle and CNTs. In this experiment, the addition of 2 % vol. CNTs in copper matrix showed 9% increase in thermal conductivity approximately compared to thesintered pure copper.

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Thermo-Physical Properties of Copper Matrix Composites Reinforced with 3D-SiC Network

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.150-151.144 ◽

2010 ◽

Vol 150-151 ◽

pp. 144-149

Author(s):

Hong Wei Xing ◽

Jin Song Zhang ◽

Xiao Ming Cao

Keyword(s):

Thermal Conductivity ◽

Physical Properties ◽

Room Temperature ◽

Volume Fraction ◽

Copper Matrix ◽

High Thermal Stability ◽

Matrix Composites ◽

Copper Matrix Composites ◽

Specific Heat Capacities ◽

Thermo Physical Properties

Copper matrix composites reinforced with 3D-SiC network (15v% and 20v% SiC) were fabricated by squeezing copper alloy into 3D-SiC network preforms. The thermo-physical properties of the copper matrix composites were investigated. The specific heat capacities of the composites were about 0.39~0.50 J•g-1•K-1. The coefficients of thermal expansion (CTEs) of the composites were found to be lower than 6.9×10-6 -1 at Room Temperature. The composites exhibited high thermal stability for 3D-SiC network advent. The thermal conductivity of the composites was in the range of 50~80W•m−1•K−1. The thermo-physical properties of Cu matrix composites had a great relationship with the structures of 3D-SiC network preforms. The thermal conductivity of the composites decreased with an increase in the volume fraction of SiC or the structures of the limbs changing compacted, but the CTEs were not completely according this rule.

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On the synthesis and thermal conductivity of nanocomposites with multiwalled carbon nanotubes

Journal of Surface Investigation X-ray Synchrotron and Neutron Techniques ◽

10.1134/s1027451015040370 ◽

2015 ◽

Vol 9 (4) ◽

pp. 784-788 ◽

Cited By ~ 4

Author(s):

E. A. Vorobyeva ◽

I. V. Makarenko ◽

A. V. Makunin ◽

V. A. Trifonov ◽

N. G. Chechenin

Keyword(s):

Thermal Conductivity ◽

Carbon Nanotubes ◽

Multiwalled Carbon Nanotubes ◽

Multiwalled Carbon

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A Novel Way to Fabricate Carbon Nanotubes Reinforced Copper Matrix Composites by Friction Stir Processing

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.391-392.524 ◽

2011 ◽

Vol 391-392 ◽

pp. 524-529 ◽

Cited By ~ 5

Author(s):

Wen Liang Chen ◽

Chun Ping Huang ◽

Li Ming Ke

Keyword(s):

Carbon Nanotubes ◽

Grain Size ◽

Friction Stir Processing ◽

Copper Matrix ◽

Parent Material ◽

Experimental Results ◽

Matrix Composites ◽

Small Decrease ◽

Copper Matrix Composites ◽

Friction Stir

Carbon nanotubes(CNTs) reinforced copper matrix composites were successfully produced by Friction Stir Processing (FSP). The effect of applying multiple FSP passes on the forming of composites was studied, the microstructure, microhardness and conductivity of the good forming composite were analyzed. The experimental results showed that CNTs uniformly distributed and good forming composite can be obtained by three FSP passes. Compared to the parent material, the grain size of the composite has significantly refined, and the microhardness of the composite has also greatly improved, but the conductivity of the composite has a small decrease.

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