Thermo-Physical Properties of Copper Matrix Composites Reinforced with 3D-SiC Network

2010 ◽  
Vol 150-151 ◽  
pp. 144-149
Author(s):  
Hong Wei Xing ◽  
Jin Song Zhang ◽  
Xiao Ming Cao

Copper matrix composites reinforced with 3D-SiC network (15v% and 20v% SiC) were fabricated by squeezing copper alloy into 3D-SiC network preforms. The thermo-physical properties of the copper matrix composites were investigated. The specific heat capacities of the composites were about 0.39~0.50 J•g-1•K-1. The coefficients of thermal expansion (CTEs) of the composites were found to be lower than 6.9×10-6 -1 at Room Temperature. The composites exhibited high thermal stability for 3D-SiC network advent. The thermal conductivity of the composites was in the range of 50~80W•m−1•K−1. The thermo-physical properties of Cu matrix composites had a great relationship with the structures of 3D-SiC network preforms. The thermal conductivity of the composites decreased with an increase in the volume fraction of SiC or the structures of the limbs changing compacted, but the CTEs were not completely according this rule.

2008 ◽  
Vol 59 ◽  
pp. 153-157 ◽  
Author(s):  
Verena Paffenholz ◽  
Stefan Lindig ◽  
Annegret Brendel ◽  
Harald Bolt

Copper matrix composites reinforced with silicon carbide fibres (SiCf/Cu) are considered as heat sink materials for the divertor of DEMO as they combine high thermal conductivity and good mechanical strength at high temperature. A new method was developed to synthesise a metal matrix composite (MMC) consisting of about 3-6 unidirectional reinforced layers (UD-layers). The UD-layers were prepared by two subsequent electroplating processes which allow to adjust various fibre volume fractions. These single UD layers were stacked with different relative fibre orientations (0°/0° and 0°/90°) and consolidated by vacuum hot pressing to form the MMC specimen. The thermal conductivity perpendicular to fibre direction was obtained by laser flash apparatus (LFA) measurements. It is about 310 Wm-1K-1 for electroplated copper (Cu) and above 200 Wm-1K-1 for MMC specimens with a fibre volume fraction of 8-13%. Due to the manufacturing process, boundaries within the matrix were found resulting in a reduction of the values. In addition, DSC (differential scanning calorimetry) measurements were performed which gave similar results.


Author(s):  
Junchen Huang ◽  
Guodong Miu ◽  
TongLe Liu ◽  
Chen Huang ◽  
Shibo Guo ◽  
...  

Abstract Graphite flake-carbon fiber coreinforced copper matrix composites were prepared by vacuum hot pressing technology. The carbon fibers were dispersed ultrasonic in alcohol and then mixed with graphite flake and alloys powder(Zr and Cu)for hot pressing sintering. The effects of the carbon fiber content on the microstructure, bending strength and thermal conductivity of the composites were investigated. The results show that the interface of the composites is well bonded. When the volume fraction of carbon fiber is 1%-3%, the carbon fiber can be uniformly dispersed in the matrix, and the bending strength of the composites can be improved effectively. When the volume fraction of carbon fiber is 2%, the bending strength reaches a maximum of 152 MPa, which is an increase of 60% compared with that of the composites without carbon fiber. However, an excessive addition of carbon fiber (4% or more) leads to an uneven distribution of carbon fiber, and the bending strength of the composites decreases. When the volume fraction of carbon fiber is 2%, the thermal conductivity of the composite is 597 W·m-1·K-1. The acoustic mismatch model (AMM) associated with the Digimat MF module is able to predict the thermal conductivity of the anisotropic multiphase composites.


2013 ◽  
Vol 27 (19) ◽  
pp. 1341025 ◽  
Author(s):  
YU HONG ◽  
XIAOLI CHEN ◽  
WENFANG WANG ◽  
YUCHENG WU

Copper-matrix composites reinforced with SiC particles are prepared by mechanical alloying. The microstructure characteristics, relative density, hardness, tensile strength, electrical conductivity, thermal conductivity and wear properties of the composites are investigated in this paper. The results indicate that the relative density, macro-hardness and mechanical properties of composites are improved by modifying the surface of SiC particles with Cu and Ni . The electrical conductivity and thermal conductivity of composites, however, are not obviously improved. For a given volume fraction of SiC , the Cu / SiC ( Ni ) has higher mechanical properties than Cu / SiC ( Cu ). The wear resistance of the composites are improved by the addition of SiC . The composites with optimized interface have lower wear rate.


2013 ◽  
Vol 48 (11) ◽  
pp. 4811-4817 ◽  
Author(s):  
Qian Liu ◽  
Xin-Bo He ◽  
Shu-Bin Ren ◽  
Ting-Ting Liu ◽  
Qi-Ping Kang ◽  
...  

2008 ◽  
Vol 59 ◽  
pp. 111-115 ◽  
Author(s):  
Ludger Weber ◽  
Reza Tavangar

Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by gas pressure infiltration into diamond powder beds with the aim to maximize thermal conductivity and to explore the range of coefficient of thermal expansion (CTE) that can be covered. The resulting composites covered roughly the range between 60 and 75 vol-% of diamond content. For the Al-based composites a maximum thermal conductivity at room temperature of 7.6 W/cmK is found while for the Ag-3Si based composites an unprecedented value of 9.7 W/cmK was achieved. The CTE at room temperature varied as a function of the diamond volume fraction between 3.3 and 7.0 ppm/K and 3.1 and 5.7 ppm/K for the Al-based and the Ag-3Si-based composites, respectively. The CTE was further found to vary quite significantly with temperature for the Al-based composites while the variation with temperature was less pronounced for the Ag-3Si-based composites. The results are compared with prediction by analytical modeling using the differential effective medium scheme for thermal conductivity and the Schapery bounds for the CTE. For the thermal conductivity good agreement is found while for the CTE a transition of the experimental data from Schapery’s upper to Schapery’s lower bound is observed as volume fraction increases. While the thermophysical properties are quite satisfactory, there is a trade-off to be made in these materials between high thermal conductivity and low CTE on the one side and surface quality and machinability on the other.


2007 ◽  
Vol 561-565 ◽  
pp. 627-630
Author(s):  
Farid Akhtar

This study deals with the processing, microstructure and properties of the carbide reinforced copper matrix composites. Powder technology was used to successfully fabricate the composites. NbC particulates were used as reinforcements for copper matrix. The microstructure of the composite was characterized by scanning electron microscopy. The microstructural study revealed that the NbC particles were distributed uniformly in the matrix phase. No interface debonding and micro- cracks were observed in the composite. NbC particles were found in round shape in copper matrix composite. The composite hardness of 78 HRA was found with 60vol% NbC content. Electrical conductivity as high as 7%IACS was achieved. The wear performance and conductivity value predicts that NbC reinforced copper matrix composites can be used as sliding contact applications.


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