Fracture behavior in electrically poled alkaline bismuth- and potassium- based lead-free piezoceramics using Vickers indentation

2021 ◽  
Vol 194 ◽  
pp. 113647
Author(s):  
Xueyao Wang ◽  
Lalitha Kodumudi Venkataraman ◽  
Chi Tan ◽  
Yingwei Li
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Vickers Indentation

Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

2007 ◽  
pp. 477-480
Author(s):  
Fei Yi Hung ◽  
Truan Sheng Lui ◽  
Li Hui Chen ◽  
Nien Ting He
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Lead Free Solders

Contact Fracture Behaviors of Ti3SiC2 Synthesized by Hot Pressing Using TiCx and Si Powder Mixture

2005 ◽  
Vol 486-487 ◽  
pp. 217-220
Author(s):  
Sung Sic Hwang ◽  
Sang Whan Park ◽  
Seong Jai Cho ◽  
Dong Bok Lee
Keyword(s):  
Plastic Deformation ◽  
Fracture Behavior ◽  
Hertzian Contact ◽  
Coarse Grained ◽  
Vickers Indentation ◽  
Hertzian Indentation ◽  
Fine Grained ◽  
Fracture Behaviors ◽  
Hertzian Contact Stress ◽  
Contact Fracture

The contact fracture behaviors of fine-grained Ti3SiC2 and coarse-grained high purity Ti3SiC2 are examined by the Hertzian indentation and Vickers indentation technique. The Vickers hardness of bulk Ti3SiC2 is as low as 5.3~6.3 Gpa, and the Hertzian contact stress-strain curves for Ti3SiC2 deviate much from linearity, which resembles the fracture behavior of a ductile metal rather than a brittle ceramic. The contact damages by both Vickers indentation and Hertzian indentation reveal a fairly good plastic deformation nature of Ti3SiC2. Un-reacted TiCx in fine-grained Ti3SiC2 may impede the plastic deformation by slip along basal plan inside Ti3SiC2 grain, making Ti3SiC2 less plastic under loading.

Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

2007 ◽  
Vol 345-346 ◽  
pp. 477-480 ◽  
Author(s):  
Fei Yi Hung ◽  
Truan Sheng Lui ◽  
Li Hui Chen ◽  
Nien Ting He
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Lead Free Solders

VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD--FREE SOLDER JOINTS

2010 ◽  
Vol 46 (3) ◽  
pp. 366-371 ◽  
Author(s):  
Yanhong TIAN ◽  
Shihua YANG ◽  
Chunqing WANG ◽  
Xuelin WANG ◽  
Pengrong LIN
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture ◽  
Volume Effect ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Single Crystal PMN-PT Electric Fatigue and Fracture Behavior

2008 ◽  
Author(s):  
E. P. Gorzkowski ◽  
M.-J. Pan ◽  
V. G. DeGiorgi ◽  
S. A. Wimmer ◽  
M. A. Siddiq Qidwai
Keyword(s):  
Single Crystal ◽  
Single Crystals ◽  
Fracture Behavior ◽  
Fatigue Behavior ◽  
Vickers Indentation ◽  
Fatigue And Fracture ◽  
Before And After ◽  
Result Show ◽  
Electric Fatigue ◽  
Over Time

Piezoelectric single crystals are being incorporated into many new devices because of the superior properties they exhibit. Not much attention has been paid to the mechanical robustness of these materials. In this work the fracture and fatigue behavior of Pb(Mg1/3Nb2/3)O3−29 mol% PbTiO3 (PMN-29PT) is studied. Vickers indentation result show that the KIC of this material is 0.3 MPa m1/2. Intentional defects from the indentation show that the <100> direction is the weakest direction and that electrical fatigue is fastest in the <100> direction. By looking at the hysteresis behavior of this material before and after the fatigue runs, the material ages over time.

Review of the mechanical and fracture behavior of perovskite lead-free ferroelectrics for actuator applications

2017 ◽  
Vol 26 (6) ◽  
pp. 063001 ◽  
Author(s):  
Kyle G Webber ◽  
Malte Vögler ◽  
Neamul H Khansur ◽  
Barbara Kaeswurm ◽  
John E Daniels ◽  
...  
Keyword(s):  
Fracture Behavior ◽  
Lead Free

Fracture Behavior and Characterization of Lead-Free Brass Alloys for Machining Applications

2014 ◽  
Vol 23 (9) ◽  
pp. 3193-3206 ◽  
Author(s):  
Anagnostis I. Toulfatzis ◽  
George A. Pantazopoulos ◽  
Alkiviadis S. Paipetis
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Brass Alloys

The micro-impact fracture behavior of lead-free solder ball joints

2008 ◽  
Vol 23 (4) ◽  
pp. 1057-1063 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Solder Joint ◽  
Fracture Energy ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Impact Fracture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Impact Fracture Behavior ◽  
Free Solder ◽  
Ball Joints

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

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