Review of the mechanical and fracture behavior of perovskite lead-free ferroelectrics for actuator applications

2017 ◽  
Vol 26 (6) ◽  
pp. 063001 ◽  
Author(s):  
Kyle G Webber ◽  
Malte Vögler ◽  
Neamul H Khansur ◽  
Barbara Kaeswurm ◽  
John E Daniels ◽  
...  
Keyword(s):  
Fracture Behavior ◽  
Lead Free

Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

2007 ◽  
pp. 477-480
Author(s):  
Fei Yi Hung ◽  
Truan Sheng Lui ◽  
Li Hui Chen ◽  
Nien Ting He
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Lead Free Solders

Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

2007 ◽  
Vol 345-346 ◽  
pp. 477-480 ◽  
Author(s):  
Fei Yi Hung ◽  
Truan Sheng Lui ◽  
Li Hui Chen ◽  
Nien Ting He
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Lead Free Solders

VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD--FREE SOLDER JOINTS

2010 ◽  
Vol 46 (3) ◽  
pp. 366-371 ◽  
Author(s):  
Yanhong TIAN ◽  
Shihua YANG ◽  
Chunqing WANG ◽  
Xuelin WANG ◽  
Pengrong LIN
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture ◽  
Volume Effect ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Fracture Behavior and Characterization of Lead-Free Brass Alloys for Machining Applications

2014 ◽  
Vol 23 (9) ◽  
pp. 3193-3206 ◽  
Author(s):  
Anagnostis I. Toulfatzis ◽  
George A. Pantazopoulos ◽  
Alkiviadis S. Paipetis
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Brass Alloys

The micro-impact fracture behavior of lead-free solder ball joints

2008 ◽  
Vol 23 (4) ◽  
pp. 1057-1063 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Solder Joint ◽  
Fracture Energy ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Impact Fracture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Impact Fracture Behavior ◽  
Free Solder ◽  
Ball Joints

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

2007 ◽  
Vol 42 (11) ◽  
pp. 3865-3873 ◽  
Author(s):  
Fei-Yi Hung ◽  
Truan-Sheng Lui ◽  
Li-Hui Chen ◽  
Ji-Ge You
Keyword(s):  
Fracture Behavior ◽  
Lead Free ◽  
Lead Free Solders
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