Comment on: “Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance”

2021 ◽  
Vol 195 ◽  
pp. 113728
Author(s):  
Karel Dušek
Keyword(s):  
Reactive Wetting ◽  
Cu Substrates

Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance

2006 ◽  
Vol 55 (9) ◽  
pp. 823-826 ◽  
Author(s):  
Hongqin Wang ◽  
Feng Gao ◽  
Xin Ma ◽  
Yiyu Qian
Keyword(s):  
Reactive Wetting ◽  
Cu Substrates

scholarly journals Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates

2009 ◽  
Vol 50 (11) ◽  
pp. 2695-2698 ◽  
Author(s):  
Taeyoung Kim ◽  
Joonho Lee ◽  
Yunkyum Kim ◽  
Jong-Min Kim ◽  
Zhangfu Yuan
Keyword(s):  
Reactive Wetting ◽  
Solder Alloys ◽  
Cu Substrates

A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

2008 ◽  
Vol 37 (10) ◽  
pp. 1640-1647 ◽  
Author(s):  
Hongqin Wang ◽  
Hui Zhao ◽  
Dusan P. Sekulic ◽  
Yiyu Qian
Keyword(s):  
Comparative Study ◽  
Lead Free ◽  
Reactive Wetting ◽  
Cu Substrates ◽  
Lead Free Solders

Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures

2012 ◽  
Vol 41 (8) ◽  
pp. 2051-2056 ◽  
Author(s):  
Likun Zang ◽  
Zhangfu Yuan ◽  
Zhanmin Cao ◽  
Hiroyuki Matsuura ◽  
Fumitaka Tsukihashi
Keyword(s):  
Elevated Temperatures ◽  
Triple Line ◽  
Reactive Wetting ◽  
Line Configuration ◽  
Cu Substrates

Extraordinary dendrite-free Li deposition on highly uniform facet wrinkled Cu substrates in carbonate electrolytes

Nano Energy ◽  
2020 ◽  
pp. 105736
Author(s):  
Ju Ye Kim ◽  
Oh B. Chae ◽  
Mihye Wu ◽  
Eunsoo Lim ◽  
Gukbo Kim ◽  
...  
Keyword(s):  
Cu Substrates ◽  
Highly Uniform

scholarly journals Effect of Plating Current Density on the Ball-On-Disc Wear of Sn-Plated Ni Coatings on Cu Foils

Coatings ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 56
Author(s):  
Ashutosh Sharma ◽  
Byungmin Ahn
Keyword(s):  
Current Density ◽  
Wear Loss ◽  
Wear Properties ◽  
Friction Behavior ◽  
Track Geometry ◽  
Cu Substrates ◽  
Current Densities ◽  
The Impact ◽  
Sliding Distance ◽  
Ball On Disc

Metallic and alloyed coatings are used widely in several decorative and technology-based applications. In this work, we selected Sn coatings plated on Cu substrates for joining applications. We employed two different plating baths for the fabrication of Sn and Ni coatings: acidic stannous sulfate for Sn and Watts bath for Ni layer. The plating current densities were varied from 100–500 mA/cm2. Further, the wear and friction behavior of the coatings were studied using a ball-on-disc apparatus under dry sliding conditions. The impact of current density was studied on the morphology, wear, and coefficient of friction (COF) of the resultant coatings. The wear experiments were done at various loads from 2–10 N. The sliding distance was fixed to 7 m. The wear loss was quantified in terms of the volume of the track geometry (width and depth of the tracks). The results indicate that current density has an important role in tailoring the composition and morphology of coatings, which affects the wear properties. At higher loads (8–10 N), Sn coatings on Ni/Cu had higher volume loss with a stable COF due to a mixed adhesive and oxidative type of wear mechanism.

Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles

2021 ◽  
Author(s):  
Daiki Yamagiwa ◽  
Tomoki Matsuda ◽  
Hideki Furusawa ◽  
Kenji Sato ◽  
Hiroaki Tatsumi ◽  
...  
Keyword(s):  
Pressureless Sinter ◽  
Gas Atmosphere ◽  
Cu Substrates ◽  
Sinter Joining

scholarly journals Crystallographic Correlations between Galvanically Substituted Au Films and Cu Substrates

1973 ◽  
Vol 24 (6) ◽  
pp. 333-338
Author(s):  
Yoshimi TANABE ◽  
Toshihisa SUDO
Keyword(s):  
Cu Substrates

Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems

2021 ◽  
pp. 111304
Author(s):  
Samuel Griffiths ◽  
Andre Wedi ◽  
Guido Schmitz
Keyword(s):  
Work Of Adhesion ◽  
Reactive Wetting
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