A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

2008 ◽  
Vol 37 (10) ◽  
pp. 1640-1647 ◽  
Author(s):  
Hongqin Wang ◽  
Hui Zhao ◽  
Dusan P. Sekulic ◽  
Yiyu Qian
Keyword(s):  
Comparative Study ◽  
Lead Free ◽  
Reactive Wetting ◽  
Cu Substrates ◽  
Lead Free Solders

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

2009 ◽  
Vol 38 (6) ◽  
pp. 873-883 ◽  
Author(s):  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
Katsuaki Suganuma ◽  
Goro Izuta
Keyword(s):  
High Temperature ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Die Attachment ◽  
Cu Substrates ◽  
Lead Free Solders

Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders

2006 ◽  
Vol 968 ◽  
Author(s):  
Su-Chun Yang ◽  
Cheng-En Ho ◽  
Chien-Wei Chang ◽  
C. Robert Kao
Keyword(s):  
Phase Diagram ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Slight Variation ◽  
Zn Addition ◽  
Zn Concentration ◽  
Cu Substrates ◽  
Kirkendall Voids ◽  
Low X ◽  
Lead Free Solders

ABSTRACTRecently, it was reported that adding Zn to solder was an effective way for reducing the formation of both Cu3Sn and Cu6Sn5 and inhibiting Kirkendall voids formation. The objective of this study is to investigate this Zn effect in detail. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt. %) were reacted with Cu substrates at 250°J for 2-10 mins. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt. %), the reaction product was Cu6Sn5. At high Zn concentration (x = 2 wt. %), the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt. %), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.

Reactive wetting of Sn0.7Cu–xZn lead-free solders on Cu substrate

2007 ◽  
Vol 433 (1-2) ◽  
pp. 302-305 ◽  
Author(s):  
Hongqin Wang ◽  
Fengjiang Wang ◽  
Feng Gao ◽  
Xin Ma ◽  
Yiyu Qian
Keyword(s):  
Lead Free ◽  
Reactive Wetting ◽  
Cu Substrate ◽  
Lead Free Solders
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