Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates
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2010 ◽
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2015 ◽
Vol 2015
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2015 ◽
Vol 2015
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pp. 1-10
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