scholarly journals Multi-criteria design of membrane cascades: Selection of configurations and process parameters

2020 ◽  
Vol 237 ◽  
pp. 116349 ◽  
Author(s):  
Zulhaj Rizki ◽  
Anja E.M. Janssen ◽  
G.D.H. Claassen ◽  
R.M. Boom ◽  
A. van der Padt
2012 ◽  
Vol 45 (4) ◽  
pp. 41 ◽  
Author(s):  
M. K. Saha ◽  
Santanu Das ◽  
A. Bandyopadhyay ◽  
S. Bandyopadhyay

2012 ◽  
Vol 45 (4) ◽  
pp. 41
Author(s):  
M. K. Saha ◽  
Santanu Das ◽  
A. Bandyopadhyay ◽  
S. Bandyopadhyay

2020 ◽  
Author(s):  
A. Singh ◽  
I. Shivakoti ◽  
Z. Mustafa ◽  
R. Phipon ◽  
A. Sharma

2016 ◽  
Vol 874 ◽  
pp. 291-296 ◽  
Author(s):  
Lin Li ◽  
Jun Wang ◽  
Huai Zhong Li

An experimental study is reported to characterise the femtosecond (FS) laser grooving process for Germanium (Ge) substrates. The effects of process parameters, including laser fluence, pulse repetition rate and scan speed, on the groove characteristics, material removal rate (MRR) and heat affected zone (HAZ) size are discussed. It is shown that with properly selected process parameters, high quality micro-grooves can be obtained on Ge wafers. Recommendations are finally made on the selection of the most appropriate process parameters for FS micro-grooving of Ge substrates.


2008 ◽  
Vol 389-390 ◽  
pp. 493-497 ◽  
Author(s):  
Sung Chul Hwang ◽  
Jong Koo Won ◽  
Jung Taik Lee ◽  
Eun Sang Lee

As the level of Si-wafer surface directly affects device line-width capability, process latitude, yield, and throughput in fabrication of microchips, it needs to have ultra precision surface and flatness. Polishing is one of the important processing having influence on the surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is mainly affected by the many process parameters. For decreasing the surface roughness, the control of polishing parameters is very important. In this paper, the optimum condition selection of ultra precision wafer polishing and the effect of polishing parameters on the surface roughness were evaluated by the statistical analysis of the process parameters.


2015 ◽  
Vol 21 (6) ◽  
pp. 630-648 ◽  
Author(s):  
Sunil Kumar Tiwari ◽  
Sarang Pande ◽  
Sanat Agrawal ◽  
Santosh M. Bobade

Purpose – The purpose of this paper is to propose and evaluate the selection of materials for the selective laser sintering (SLS) process, which is used for low-volume production in the engineering (e.g. light weight machines, architectural modelling, high performance application, manufacturing of fuel cell, etc.), medical and many others (e.g. art and hobbies, etc.) with a keen focus on meeting customer requirements. Design/methodology/approach – The work starts with understanding the optimal process parameters, an appropriate consolidation mechanism to control microstructure, and selection of appropriate materials satisfying the property requirement for specific application area that leads to optimization of materials. Findings – Fabricating the parts using optimal process parameters, appropriate consolidation mechanism and selecting the appropriate material considering the property requirement of applications can improve part characteristics, increase acceptability, sustainability, life cycle and reliability of the SLS-fabricated parts. Originality/value – The newly proposed material selection system based on properties requirement of applications has been proven, especially in cases where non-experts or student need to select SLS process materials according to the property requirement of applications. The selection of materials based on property requirement of application may be used by practitioners from not only the engineering field, medical field and many others like art and hobbies but also academics who wish to select materials of SLS process for different applications.


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