scholarly journals Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

2005 ◽  
Vol 198 (1-3) ◽  
pp. 85-89 ◽  
Author(s):  
Zhenghao Gan ◽  
S.G. Mhaisalkar ◽  
Zhong Chen ◽  
Sam Zhang ◽  
Zhe Chen ◽  
...  
Keyword(s):  
Thin Film ◽  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Bending Test ◽  
Four Point Bending ◽  
Four Point Bending Test ◽  
Interfacial Adhesion Energy

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

2000 ◽  
Author(s):  
Timothy P. Ferguson ◽  
Jianmin Qu
Keyword(s):  
Interfacial Adhesion ◽  
Bending Test ◽  
Primary Concern ◽  
Polymer Interfaces ◽  
Interfacial Toughness ◽  
Four Point Bending ◽  
Four Point Bending Test ◽  
Effect Of Moisture ◽  
Package Reliability

Abstract A primary concern in microelectronic packaging is the role of moisture induced failure mechanisms. Moisture is a multidimensional concern in packaging, having an adverse effect on package reliability by introducing corrosion, development of hygro-stresses, and deterioration of polymer interfaces within the package. In this paper the effect of moisture on the interfacial adhesion of two no flow underfill materials with a commercially available soldermask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.

Coupled Nanoscratch and 4-Point Bending Evaluations of Adhesion in SiCN/Cu/Ta/TaN/SiO2/Si Stacked Layers

2008 ◽  
Vol 1086 ◽  
Author(s):  
Kouji Yoneda ◽  
Satoshi Shimizu ◽  
Nobuo Kojima ◽  
Chikai Sato ◽  
Jiping Ye
Keyword(s):  
Thin Film ◽  
Plastic Deformation ◽  
Small Area ◽  
Bending Test ◽  
Adhesion Properties ◽  
Bending Tests ◽  
Four Point Bending ◽  
Quantitative Measurements ◽  
Similarities And Differences ◽  
Four Point Bending Test

AbstractNanoscratch test used for small area measurements and four-point bending test applied for quantitative measurements were coupled to evaluate the adhesive strengths of SiCN/Cu/Ta,/TaN/SiO2/Si stacked layers. The similarities and differences of the two methods concerning adhesion, position of the delamination interface, and plastic deformation of the delaminated film were estimated. It was found that the nanoscratch test gave similar adhesion properties when the delamination interface was the same as that formed by the four-point bending test. The four-point bending test displayed clearer results compared to the nanoscratch test because energy for delamination was not used in plastic deformation and the crack could propagate further. These results suggest that coupling the nanoscratch and four-point bending tests is powerful way to estimate and understand adhesion of thin film materials.

Aluminum Thermo Compression Bonding Characterization

2009 ◽  
Vol 1222 ◽  
Author(s):  
Erkan Cakmak ◽  
Viorel Dragoi ◽  
Eric Pabo ◽  
Thorsten Matthias ◽  
T. L. Alford
Keyword(s):  
Interfacial Adhesion ◽  
Microelectromechanical Systems ◽  
Bonding Temperature ◽  
Acoustic Microscopy ◽  
Bending Test ◽  
Wafer Level ◽  
Bond Quality ◽  
Four Point Bending ◽  
Bond Strengths ◽  
Four Point Bending Test

AbstractWafer level bonding is an important technology for the manufacturing of numerous Microelectromechanical Systems. In this work the aluminum thermo-compression wafer bonding is characterized. The effects and significance of various bond process parameters and surface treatment methods are reported on the final bond interfaces integrity and strength. Experimental variables include the bonding temperature, bonding time, and bonding atmosphere (forming gas and inert gas). Bonded wafer samples were investigated with scanning acoustic microscopy, scanning electron microscopy, and four point bending test. Interfacial adhesion energy and bond quality were found to be positively correlated with bonding temperature. A bonding temperature of 500 °C or greater is necessary to obtain bond strengths of 8-10 J/m2.

scholarly journals A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4Plasma Treatment

2007 ◽  
Vol 17 (4) ◽  
pp. 215-221 ◽  
Author(s):  
Sung-Cheol Park ◽  
Su-Hwan Cho ◽  
Hyun-Cheol Jung ◽  
Jae-Woo Joung ◽  
Young-Bae Park
Keyword(s):  
Thin Film ◽  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Interfacial Adhesion Energy

One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

2018 ◽  
Vol 85 (5) ◽  
Author(s):  
Tingting Zhu ◽  
Sinan Müftü ◽  
Kai-tak Wan
Keyword(s):  
Thin Film ◽  
Contact Area ◽  
Interfacial Adhesion ◽  
External Pressure ◽  
Adhesion Energy ◽  
Blister Test ◽  
One Dimensional ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Interfacial Adhesion Energy

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w0, above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w0, c) is established for a fixed interfacial adhesion energy.

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