One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

2018 ◽  
Vol 85 (5) ◽  
Author(s):  
Tingting Zhu ◽  
Sinan Müftü ◽  
Kai-tak Wan
Keyword(s):  
Thin Film ◽  
Contact Area ◽  
Interfacial Adhesion ◽  
External Pressure ◽  
Adhesion Energy ◽  
Blister Test ◽  
One Dimensional ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Interfacial Adhesion Energy

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w0, above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w0, c) is established for a fixed interfacial adhesion energy.

scholarly journals Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

2017 ◽  
Vol 84 (7) ◽  
Author(s):  
Tingting Zhu ◽  
Guangxu Li ◽  
Sinan Müftü ◽  
Kai-tak Wan
Keyword(s):  
Thin Film ◽  
Solid Mechanics ◽  
Small Strain ◽  
Adhesion Energy ◽  
Deformation Model ◽  
Uniform Pressure ◽  
Blister Test ◽  
Mechanics Model ◽  
Film Adhesion ◽  
Thin Film Adhesion

A thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the nondeformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and “pull-off” or spontaneous detachment from the plate. Simultaneous measurement of (p, w0, c) allows one to determine the adhesion energy, γ. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading–unloading hysteresis. The results are consistent with a large deformation model in the literature.

Thin Film Adhesion Study in Microelectronic Packaging

1991 ◽  
Vol 239 ◽  
Author(s):  
H. S. Jeong ◽  
Y. Z. Chu ◽  
M. B. Freiler ◽  
C. Durning ◽  
R. C. White
Keyword(s):  
Thin Film ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Microelectronic Packaging ◽  
Elastic Model ◽  
Blister Test ◽  
Linear Elastic ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Cure Temperature

ABSTRACTFracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

Adhesion Strength Evaluation via Constrained Blister Test I. SIBS / Polystyrene and Polypropylene

2004 ◽  
Vol 77 (2) ◽  
pp. 278-292 ◽  
Author(s):  
A. M. Mousa ◽  
M. A. Mekewi ◽  
E. S. H. El-Mosallamy ◽  
E. Baer
Keyword(s):  
Adhesion Strength ◽  
Interfacial Adhesion ◽  
Spectroscopic Analysis ◽  
Triblock Copolymers ◽  
Failure Process ◽  
Adhesion Energy ◽  
Blister Test ◽  
Molecular Weights ◽  
Interfacial Adhesion Energy ◽  
Scanning Electron

Abstract Adhesion of Styrene-Isobutylene-Styrene (SIBS) triblock copolymers to polystyrene and polypropylene was investigated at controlled ratios and molecular weights of the SIBS's polystyrene. Comparative studies of the cohesive and adhesive strengths were carried out using a carefully designed system based on monitoring a constrained blister growth. The acquired data was simulated mathematically to express adhesion main parameters of the energy of interfacial adhesion (γ) and dissipation coefficient (b). Polystyrene content of 30–40% in the SIBS exhibited maximum interfacial adhesion energy (γ) and, consequently, the highest adhesion strength compared to other SIBS samples of other polystyrene ratios. ATR-FTIR spectroscopic analysis and scanning electron microscopy (SEM) were carried out on both the substrate and the film surfaces before adhesion and after failure to assist understanding the failure process. Interpretation of SEM microphotographs and the ATR-FTIR confirmed the process to be adhesion in nature rather than cohesion.

scholarly journals A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4Plasma Treatment

2007 ◽  
Vol 17 (4) ◽  
pp. 215-221 ◽  
Author(s):  
Sung-Cheol Park ◽  
Su-Hwan Cho ◽  
Hyun-Cheol Jung ◽  
Jae-Woo Joung ◽  
Young-Bae Park
Keyword(s):  
Thin Film ◽  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Interfacial Adhesion Energy

scholarly journals Dependence of Polymer Thin Film Adhesion Energy on Cohesive Interactions between Chains

2014 ◽  
Vol 47 (15) ◽  
pp. 5286-5294 ◽  
Author(s):  
Wenjie Xia ◽  
David D. Hsu ◽  
Sinan Keten
Keyword(s):  
Thin Film ◽  
Adhesion Energy ◽  
Polymer Thin Film ◽  
Film Adhesion ◽  
Thin Film Adhesion
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