Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

2009 ◽  
Vol 517 (16) ◽  
pp. 4633-4637 ◽  
Author(s):  
A. Sridhar ◽  
D.J. van Dijk ◽  
R. Akkerman
1996 ◽  
Vol 430 ◽  
Author(s):  
C. J. Reddy ◽  
M. D. Deshpande ◽  
G. A. Hanidu

AbstractA simple waveguide measurement technique is presented to determine the complex permittivity of printed circuit board material. The printed circuit board with metal coating removed from both sides and cut into size which is the same as the cross section of the waveguide is loaded in a short X-band rectangular waveguide. Using a network analyzer, the reflection coefficient of the shorted waveguide(loaded with the sample) is measured. Using the Finite Element Method(FEM) the exact reflection coefficient of the shorted wavguide(loaded with the sample) is determined as a function of dielectric constant. Matching the measured value of the reflection coefficient with the reflection value calculated using FEM and utilizing Newton-Raphson Method, an estimate of the dielectric constant of a printed circuit board material is obtained. A comparison of estimated values of permittivity constant obtained using the present approach with the available data.


2012 ◽  
Vol 463-464 ◽  
pp. 1368-1372
Author(s):  
Jiang Zhong Hang ◽  
Yin Yin Cheng ◽  
Jie Li ◽  
Li Yi Shi ◽  
Mei Hong Zhang

In this paper an UV-curable character ink with high dispersion and stability was prepared based on acrylic resin, acrylic monomer, photo-initiator, pigment and other additives. The viscosity, particle size and surface tension of the ink were 18~22mPas, 310~330 nm and 22~25 mNm-1 at 25oC, respectively. These features showed the possibility to inkjet printing the ink on printed circuit board (PCB). Inkjet printing with high resolution can be achieved by varying the dried droplet diameter. Applied voltage and temperature during the jetting process influenced the diameter of dried droplet.


Author(s):  
Ronald R. Hylton

Abstract In situ decapsulation of plastic devices can be used to avoid the removal or alteration of failure mechanisms caused by exposure to desoldering temperatures. This paper describes techniques to decapsulate devices mounted to a printed circuit board using materials that are readily available and easily customized to specific applications. The techniques are extended to the decapsulation of other packaging technologies, such as SBGA packages and chip-on-board assemblies. Finally, post decapsulation cleaning techniques that will not harm the printed circuit board material are presented.


2007 ◽  
Vol 23 (2-4) ◽  
pp. 141-145 ◽  
Author(s):  
Jiae Lee ◽  
Hyosoon Shin ◽  
Jonghee Kim ◽  
Hogyu Yoon

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