Study on Heat Pipe Heat Dissipation of High-power Ultrasonic Transducer

Ultrasonics ◽  
2021 ◽  
pp. 106654
Author(s):  
Ye Yao ◽  
Yue Pan ◽  
Shiqing Liu
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Dissipation ◽  
Ultrasonic Transducer ◽  
Power Ultrasonic ◽  
Pipe Heat

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2012 ◽  
Vol 490-495 ◽  
pp. 2278-2281
Author(s):  
Yun Jun Gou ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Exchangers ◽  
Heat Dissipation ◽  
Cooling System ◽  
Heat Pipes ◽  
Two Phase ◽  
High Power Led ◽  
Two Phase Heat Transfer ◽  
Pipe Heat

A new cooling concept for high power LED street lamp by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a series of heat pipes with specific fins structure were developed. Through experimental results, we found the new heat pipe heat exchangers have the features of higher efficiency of heat dissipation and more compact construction which meets the demand of heat dissipation for high power LED than the traditional heat pipe heat exchangers and the new exchanger with outwards-radiate structure has the best heat dissipation performance.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2011 ◽  
Vol 295-297 ◽  
pp. 1985-1988
Author(s):  
Yu Jun Gou ◽  
Zhong Liang Liu ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
High Power ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Two Phase ◽  
High Power Led ◽  
New Type ◽  
Two Phase Heat Transfer

A new cooling concept for high power LED by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a new type of heat pipe with specific fins structure was developed. Through experimental results, we found the new heat pipe heat exchanger has the features of high efficiency of heat dissipation and compact construction which meets the demand of heat dissipation for high power LED. We also found the heat dissipation performance of the HP heat exchanger changed with the work angle.

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