Enhancing the thermal stability of low dielectric constant hydrogen silsesquioxane by ion implantation

1998 ◽  
Vol 332 (1-2) ◽  
pp. 351-355 ◽  
Author(s):  
T.C Chang ◽  
M.F Chou ◽  
Y.J Mei ◽  
J.S Tsang ◽  
F.M Pan ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Ion Implantation ◽  
Low Dielectric Constant ◽  
Hydrogen Silsesquioxane ◽  
Low Dielectric ◽  
Thermal Stability Of

Curing Process Window and Thermal Stability of Porous MSQ-Based Low-Dielectric-Constant Materials

2004 ◽  
Vol 151 (6) ◽  
pp. F146 ◽  
Author(s):  
Shou-Yi Chang ◽  
Tzu-Jen Chou ◽  
Yung-Cheng Lu ◽  
Syun-Ming Jang ◽  
Su-Jien Lin ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Process Window ◽  
Curing Process ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials ◽  
Thermal Stability Of

Thermal stability of low dielectric constant porous silica films

2005 ◽  
Vol 87 (26) ◽  
pp. 262909 ◽  
Author(s):  
L. Esposito ◽  
G. Ottaviani ◽  
E. Carollo ◽  
M. Bacchetta
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Porous Silica ◽  
Low Dielectric Constant ◽  
Silica Films ◽  
Low Dielectric ◽  
Thermal Stability Of

Properties and thermal stability of porous organic low-dielectric-constant materials

2004 ◽  
Vol 466 (1-2) ◽  
pp. 54-61 ◽  
Author(s):  
Shou-Yi Chang ◽  
Syun-Ming Jang ◽  
Su-Jien Lin ◽  
Mong-Song Liang
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials ◽  
Thermal Stability Of
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