Curing Process Window and Thermal Stability of Porous MSQ-Based Low-Dielectric-Constant Materials

AbstractPoly(arylene ethers)s are low dielectric constant organic spin on materials. PAE-2, which is a non-fluorinated poly(arylene ether), exhibits a dielectric constant below 3.0, thermal stability greater than 425 °C as well as excellent adhesion to Si, SiO2, and Al. These are the major atributes which makes it a very attractive candidate for integration as an interlevel or inter-metal dielectric material (ILD). Material properties including dielectric constant, thermal stability, moisture absorption, and mechanical analysis will be discussed.

Download Full-text

Thermal stability of low dielectric constant porous silica films

Applied Physics Letters ◽

10.1063/1.2159093 ◽

2005 ◽

Vol 87 (26) ◽

pp. 262909 ◽

Cited By ~ 3

Author(s):

L. Esposito ◽

G. Ottaviani ◽

E. Carollo ◽

M. Bacchetta

Keyword(s):

Thermal Stability ◽

Dielectric Constant ◽

Porous Silica ◽

Low Dielectric Constant ◽

Silica Films ◽

Low Dielectric ◽

Thermal Stability Of

Download Full-text

Enhancing the thermal stability of low dielectric constant hydrogen silsesquioxane by ion implantation

Thin Solid Films ◽

10.1016/s0040-6090(98)01036-0 ◽

1998 ◽

Vol 332 (1-2) ◽

pp. 351-355 ◽

Cited By ~ 9

Author(s):

T.C Chang ◽

M.F Chou ◽

Y.J Mei ◽

J.S Tsang ◽

F.M Pan ◽

...

Keyword(s):

Thermal Stability ◽

Dielectric Constant ◽

Ion Implantation ◽

Low Dielectric Constant ◽

Hydrogen Silsesquioxane ◽

Low Dielectric ◽

Thermal Stability Of

Download Full-text

Pulsed Plasma Synthesis of Low Dielectric Constant Materials

MRS Proceedings ◽

10.1557/proc-511-93 ◽

1998 ◽

Vol 511 ◽

Cited By ~ 5

Author(s):

Licheng M. Han ◽

Richard B. Timmons ◽

Wei W. Lee

Keyword(s):

Thermal Stability ◽

Dielectric Constant ◽

Dielectric Constants ◽

Low Dielectric Constant ◽

Plasma Synthesis ◽

Pulsed Plasma ◽

Plasma Polymers ◽

Low Dielectric ◽

Duty Cycles ◽

Low Dielectric Constant Materials

ABSTRACTThe utility of a variable duty cycle, pulsed plasma polymerization technique to produce low dielectric constant materials (k < 2.3) is described. The molecular compositions (and thus the dielectric constants) of the plasma polymers are controllable via changes in the plasma duty cycles employed during synthesis, all other reaction variables being held constant. In the present study, this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers. The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased. Although the as deposited films exhibit relatively poor thermal stability, it was discovered that post-plasma annealing of the films, particularly at 400 °C under N2, provides dramatic improvements in the thermal stability of these materials. Most importantly, this enhanced thermal stability is achieved with relatively minor changes in the dielectric properties of these materials. In fact, synthesis of high thermal stability films having k < 2.0 is demonstrated in this work using the perfluoroaromatic monomer perfluoroallyl benzene.

Download Full-text