Dislocation creep of fine-grained recrystallized plagioclase under low-temperature conditions

2000 ◽  
Vol 22 (1) ◽  
pp. 65-79 ◽  
Author(s):  
Norio Shigematsu ◽  
Hidemi Tanaka
Keyword(s):  
Low Temperature ◽  
Dislocation Creep ◽  
Fine Grained ◽  
Temperature Conditions

TRI-MARK TM-811N2

Alloy Digest ◽  
1983 ◽  
Vol 32 (4) ◽  
Keyword(s):  
Low Temperature ◽  
High Strength ◽  
Heat Treating ◽  
Low Alloy Steels ◽  
Nickel Steel ◽  
Fine Grained ◽  
Subzero Temperatures ◽  
Steel Weld Metal ◽  
Alloy Steels ◽  
Welding Electrode

Abstract TRI-MARK TM-811N2 is a flux-cored welding electrode for all position semiautomatic arc welding. It is designed to weld 2-3% nickel steels for applications requiring good toughness at subzero temperatures; in addition, it is used to weld various other high-strength low-alloy steels and various fine-grained steels with low-temperature toughness. Tri-Mark TM-811N2 is used to deposit typically 2.35% nickel steel weld metal with good low-temperature impact properties. It is used for shipbuilding, oil rigs and similar structures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as fracture toughness. It also includes information on corrosion resistance as well as heat treating, machining, and joining. Filing Code: SA-389. Producer or source: Tri-Mark Inc..

scholarly journals Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 111
Author(s):  
Ivana O. Mladenović ◽  
Nebojša D. Nikolić ◽  
Jelena S. Lamovec ◽  
Dana Vasiljević-Radović ◽  
Vesna Radojević
Keyword(s):  
Mechanical Characteristics ◽  
Dislocation Creep ◽  
Average Current Density ◽  
Fine Grained ◽  
Copper Coatings ◽  
Electrochemically Deposited ◽  
Composite Models ◽  
Average Current ◽  
Composite Hardness ◽  
Coating Hardness

The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 µm thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm−2, and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418–1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the “soft film on hard substrate” composite hardness system. The obtained stress exponents in the 4.35–7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.

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