MERLOT: a model for flow and heat transfer through porous media for high heat flux applications

Detailed heat transfer characteristics of particle-sintered porous media and metal foams are evaluated to specify the important structural parameters suitable for high heat removal. The porous media used in this experiment are particle-sintered porous media made of bronze and SUS316L, and metal foams made of copper and nickel. Cooling water flows into the porous medium opposite to heat flux input loaded by a plasma arcjet. The result indicates that the bronze-particle porous medium of 100μm in pore size shows the highest performance and achieves heat transfer coefficient of 0.035MW/m2K at inlet heat flux 4.6MW/m2. Compared with the heat transfer performance of copper fiber-sintered porous media, the bronze particlesintered ones give lower heat transfer coefficient. However, the stable cooling conditions that the heat transfer coefficient does not depend on the flow velocity, were confirmed even at heat flux of 4.6MW/m2 in case of the bronze particle-sintered media, while not in the case of the copper-fiber sintered media. This signifies the possibility that the bronze-particle sintered media enable much higher heat flux removal of over 10MW/m2, which could be caused by higher permeability of the particle-sintered pore structures. Porous media with high permeability provide high performance of vapor evacuation, which leads to more stable heat removal even under extremely high heat flux. On the other hand, the heat transfer coefficient of the metal foams becomes lower because of the lower capillary and fin effects caused by too high porosity and low effective thermal conductivity. It is concluded that the pore structure having high performance of vapor evacuation as well as the high capillary and high fin effects is appropriate for extremely high heat flux removal of over 10MW/m2.

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Numerical investigation of fluid flow and heat transfer under high heat flux using rectangular micro-channels

International Communications in Heat and Mass Transfer ◽

10.1016/j.icheatmasstransfer.2011.12.002 ◽

2012 ◽

Vol 39 (2) ◽

pp. 291-297 ◽

Cited By ~ 18

Author(s):

Mohammad M. Mansoor ◽

Kok-Cheong Wong ◽

Mansoor Siddique

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Fluid Flow ◽

Numerical Investigation ◽

High Heat ◽

High Heat Flux ◽

Flow And Heat Transfer ◽

Micro Channels

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Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Journal of Heat Transfer ◽

10.1115/1.4003284 ◽

2011 ◽

Vol 133 (5) ◽

Cited By ~ 87

Author(s):

Liang Gong ◽

Krishna Kota ◽

Wenquan Tao ◽

Yogendra Joshi

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Fluid Flow ◽

Thermal Performance ◽

Numerical Study ◽

High Heat ◽

High Heat Flux ◽

Laminar Fluid Flow ◽

Flow And Heat Transfer ◽

Wavy Channels

Wavy channels were investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in microsized wavy channels was performed by varying the wavy feature amplitude, wavelength, and aspect ratio for different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs directly face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.

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Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B ◽

10.1115/imece2010-40788 ◽

2010 ◽

Author(s):

Liang Gong ◽

Krishna Kota ◽

Wenquan Tao ◽

Yogendra Joshi

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Fluid Flow ◽

Thermal Performance ◽

Numerical Study ◽

High Heat ◽

High Heat Flux ◽

Laminar Fluid Flow ◽

Flow And Heat Transfer ◽

Wavy Channels

Wavy channels are investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in micro-sized wavy channels was performed by varying the wavy feature amplitude and wavelength at different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.

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Pool Boiling of Nanofluids in Vertical Porous Media

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.388.18 ◽

2013 ◽

Vol 388 ◽

pp. 18-22 ◽

Cited By ~ 1

Author(s):

Ridho Irwansyah ◽

Nandy Putra

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Porous Media ◽

Single Phase ◽

Pool Boiling ◽

High Heat ◽

High Heat Flux ◽

Sintered Copper ◽

Order Of Magnitude ◽

Screen Mesh

The development of electronic components such as microprocessor requires a better thermal management system to overcome the high heat flux produce by the component. The method to absorb the heat produce by the microprocessor is still use the conduction or either natural or free convection which still in a single phase heat transfer. One of heat transfer method that suitable for a high heat flux application is pool boiling which has a two order of magnitude higher than of a single phase heat transfer and does not require a pump to move the fluid. In this study has been conducted the pool boiling experiment with four different porous media surface which are sintered copper 300 µm and 400 µm, copper screen mesh and stainless steel screen mesh with four different fluid which are Al2O3-Water 1%, 3% and 5%. The sintered copper 400 µm has shown a better heat transfer performance compared to the other porous media. The Water, Al2O3-Water 5% has shown a performance no better than Al2O3-Water 1% and 3%.

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