A finite-element analysis of temperature distributions in spade drilling

Control of temperature in large-scale manufacturing environments is not always practical or economical, introducing thermal effects including variation in ambient refractive index and thermal expansion. Thermal expansion is one of the largest contributors to measurement uncertainty; however, temperature distributions are not widely measured. Uncertainties can also be introduced in scaling to standard temperature. For more complex temperature distributions with non-linear temperature gradients, uniform scaling is unrealistic. Deformations have been measured photogrammetrically in two thermally challenging scenarios with localised heating. Extended temperature measurement has been tested with finite element analysis to assess a compensation methodology for coordinate measurement. This has been compared to commonly used uniform scaling and has outperformed this with a highly simplified finite element analysis simulation in scaling a number of coordinates at once. This work highlighted the need for focus on reproducible temperature measurement for dimensional measurement in non-standard environments.

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A Novel Crossed Traveling Wave Induction Heating System and Finite Element Analysis of Eddy Current and Temperature Distributions

IEEE Transactions on Magnetics ◽

10.1109/tmag.2009.2021667 ◽

2009 ◽

Vol 45 (10) ◽

pp. 4777-4780 ◽

Cited By ~ 17

Author(s):

S.L. Ho ◽

Junhua Wang ◽

W.N. Fu ◽

Y.H. Wang

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Induction Heating ◽

Eddy Current ◽

Traveling Wave ◽

Heating System ◽

Element Analysis ◽

Temperature Distributions ◽

Induction Heating System

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Three-dimensional finite element analysis of current density and temperature distributions during radio-frequency ablation

IEEE Transactions on Biomedical Engineering ◽

10.1109/10.412649 ◽

1995 ◽

Vol 42 (9) ◽

pp. 879-890 ◽

Cited By ~ 132

Author(s):

D. Panescu ◽

J.G. Whayne ◽

S.D. Fleischman ◽

M.S. Mirotznik ◽

D.K. Swanson ◽

...

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Radio Frequency ◽

Current Density ◽

Three Dimensional ◽

Radio Frequency Ablation ◽

Element Analysis ◽

Temperature Distributions ◽

Dimensional Finite Element ◽

Three Dimensional Finite Element

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J-2 PREDICTING THE EFFECTS OF SMAW PROCESS PARAMETERS ON TEMPERATURE DISTRIBUTIONS IN PIPE WELDED JOINTS USING THREE-DIMENSIONAL FINITE ELEMENT ANALYSIS(Session: Interface/FEM/CAE)

The Proceedings of the Asian Symposium on Materials and Processing ◽

10.1299/jsmeasmp.2006.158 ◽

2006 ◽

Vol 2006 (0) ◽

pp. 158

Author(s):

M.M. Mahapatra ◽

G.L. Datta ◽

B. Pradhan

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Process Parameters ◽

Welded Joints ◽

Three Dimensional ◽

Element Analysis ◽

Temperature Distributions ◽

Dimensional Finite Element ◽

Three Dimensional Finite Element

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A Numerical Solution of the Inverse Problem for Thermoforming Processes Using Finite Element Analysis

10.1115/imece2000-1240 ◽

2000 ◽

Author(s):

Chao-Hsin Wang ◽

Herman F. Nied

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Temperature Distribution ◽

Initial Temperature ◽

Initial Conditions ◽

Heat Transfer Analysis ◽

Element Analysis ◽

Initial Temperature Distribution ◽

Final Thickness ◽

Temperature Distributions

Abstract Finite element analysis of thermoforming simulation based on isothermal as well as non-isothermal initial conditions has been applied successfully for predicating final thickness distributions. For these simulations, it is assumed that the initial sheet temperature is known and does not change significantly during forming at a rapid stretch rate. For a non-isothermal analysis, the temperature dependent material properties are necessary. In this paper sample results are presented for the so-called inverse thermoforming problem, where an initial temperature distribution is sought numerically that will result in a specific final thickness distribution. Thus, a finite element simulation is combined with an iterative algorithm to obtain inverse solutions for a thermoformed part. In this example, the required initial temperature distributions that result in a uniform final thickness are determined for a thermoformed part. It is shown that the calculated results are quite sensitive to perturbations in the specified initial temperature profile and thus the practical application of optimal temperature distributions may require high precision thermal sensors and controls. This initial temperature distribution can then be used for the determination of desired heating patterns on zone-controlled heaters of a thermoforming machine using transient heat transfer analysis.

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Thermoelastic Solutions for a Finite Substrate With an Electronic Device

Journal of Electronic Packaging ◽

10.1115/1.2905372 ◽

1991 ◽

Vol 113 (1) ◽

pp. 84-88 ◽

Cited By ~ 4

Author(s):

J. H. Lau

Keyword(s):

Finite Element Analysis ◽

Exact Solution ◽

Finite Element ◽

Steady State ◽

Thick Plate ◽

Electronic Device ◽

Finite Thickness ◽

Stress Distributions ◽

Element Analysis ◽

Temperature Distributions

Sneddon and Lockett obtained a fairly general solution to the steady-state thermoelastic problem for the thick plate (Sneddon and Lockett, 1960). In particular, they have obtained the exact solutions for axially symmetrical temperature distributions on the upper surface of the thick plate. In this note, their exact solution will be applied to an electronic problem, namely, a chip on a substrate with finite thickness. Emphasis is placed on the generation of dimensionless charts for the temperature, displacement, and stress distributions in the substrates. These charts are not only useful for designing substrates but also can be used to verify finite element analysis procedures.

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