Effect of additional element and heat treating temperature on micro-structure and mechanical behavior of Ag alloy thin film

2006 ◽  
Vol 16 ◽  
pp. s217-s219
Author(s):  
Dong-ying JU ◽  
S ISHIGURO ◽  
T ARIZONO ◽  
K HASEGAWAK
2009 ◽  
Vol 614 ◽  
pp. 223-228 ◽  
Author(s):  
Dong Ying Ju ◽  
S. Ishiguro ◽  
K. Hasegawa ◽  
T. Arizono

For Ag film used for storage media, it is required to have heat-resistant, anti-constant temperature, anti-constant humidity characteristics and corrosion resistance, while the high reflectivity of Al is maintained. An Ag thin film (additive elements Pd, Cu and P) was produced on glass substrates and various heat treatments were conducted. Then, the fine structure on this thin film was observed by AFM, and fine structure evaluation in the inside was carried out by in-plane diffraction and X-ray diffraction. In addition, residual stress analysis was performed. These results were compared and examined, and the fine structure and physical properties in a metallic thin film were evaluated.


2006 ◽  
Vol 976 ◽  
Author(s):  
Junya Inoue ◽  
Yousuke Fujii ◽  
Toshihiko Koseki

AbstractIn this study, mechanical behavior of nanocrystalline Cu alloy thin films under constant tensile strain is studied, by taking advantage of the enhanced resistance to strain localization of a thin metal film on a thick elastomer with appropriate Young's modulus. Cu and Cu alloy thin films with a thickness of 100nm were deposited on heat-resistant polyimide substrates. On the top of the Cu alloy layer, Ta thin film was further deposited to suppress the surface diffusion of Cu alloy. A uniform uniaxial tensile strain was induced to the films by applying a constant radius of curvature to the polyimide substrate. Isothermal deformation and rupture modes of the films were studied by keeping the samples at various elevated temperatures. Microstructural observation was carried out using SEM, TEM, STEM, and confocal violet laser microscope at several stages of deformation. From the observation, the evolution of damage in the sub-critical strain level and the effect of alloying elements are discussed.


Author(s):  
Peng Lei ◽  
Congchun Zhang ◽  
Yawen Pang ◽  
Shenyong Yang ◽  
Meiju Zhang

2004 ◽  
Vol 43 (3) ◽  
pp. 1006-1012 ◽  
Author(s):  
Sung Hyuck An ◽  
Xuezhe Li ◽  
Sang Youl Kim

MRS Bulletin ◽  
1990 ◽  
Vol 15 (3) ◽  
pp. 45-52 ◽  
Author(s):  
A.M. Homola ◽  
C.M. Mate ◽  
G.B. Street

Metallic alloy thin film media and ever decreasing head-to-media spacing make severe demands on storage devices. Decreasing head-to-media separation is critical for high storage densities but it also leads to increased slider-disk interactions, which can cause slider and disk wear or even head crashes. Wear can also occur when drives start and stop when the slider contacts the disk at relatively high speeds. The reliability and durability of thin film disks, which provide much higher areal density than conventional oxide disks with particulate media, are achieved by the use of very thin overcoat materials and surface lubricants. This article summarizes the approaches taken in the industry to enhance the tribological performance of magnetic media, with special emphasis on the basic understanding of the processes occurring at the slider-disk interface.The continuous rise in the demand for storage capacity at a competitive price is the prime motivator of the changes we have seen in the data storage industry. It is clearly stimulating the present move away from particulate media, which has long dominated all fields of data storage, i.e., tape, rigid, and flexible disks, to the thin film storage media. Particulate storage devices use magnetic media formulated by dispersing magnetic particles, usually iron oxides, in an organic binder. In thin film storage devices, the storage medium is a continuous magnetic film, usually a cobalt alloy, made either by sputtering or by electroless plating.


2021 ◽  
Vol MA2021-01 (18) ◽  
pp. 797-797
Author(s):  
Shaukat Ali Lone ◽  
Cezarina Cela Mardare ◽  
Andrei Ionut Mardare ◽  
Achim Walter Hassel

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