Velocity measurement technique for high-speed targets based on digital fine spectral line tracking

2006 ◽  
Vol 17 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Wen Shuliang ◽  
Yuan Qi
1991 ◽  
Vol 224 ◽  
Author(s):  
C. Schietinger ◽  
B. Adams ◽  
C. Yarling

AbstractA novel wafer temperature and emissivity measurement technique for rapid thermal processing (RTP) is presented. The ‘Ripple Technique’ takes advantage of heating lamp AC ripple as the signature of the reflected component of the radiation from the wafer surface. This application of Optical Fiber Thermometry (OFT) allows high speed measurement of wafer surface temperatures and emissivities. This ‘Ripple Technique’ is discussed in theoretical and practical terms with wafer data presented. Results of both temperature and emissivity measurements are presented for RTP conditions with bare silicon wafers and filmed wafers.


2016 ◽  
Vol 45 (12) ◽  
pp. 1217001 ◽  
Author(s):  
吴立志 Wu Lizhi ◽  
陈少杰 Chen Shaojie ◽  
叶迎华 Ye Yinghua ◽  
沈瑞琪 Shen Ruiqi ◽  
刘卫 Liu Wei

Author(s):  
K. Taylor ◽  
B. Nelson ◽  
A. Chong ◽  
H. Nguyen ◽  
H. Lin ◽  
...  

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