Determination of fiber bridging stress profile by debond length measurement

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

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Determination of the stress profile in a deep borehole in a naturally fractured reservoir

International Journal of Rock Mechanics and Mining Sciences ◽

10.1016/j.ijrmms.2010.03.014 ◽

2010 ◽

Vol 47 (4) ◽

pp. 599-605 ◽

Cited By ~ 5

Author(s):

Reza Sanaee ◽

S. Reza Shadizadeh ◽

M. Ali Riahi

Keyword(s):

Stress Profile ◽

Fractured Reservoir ◽

Deep Borehole ◽

Naturally Fractured Reservoir ◽

Naturally Fractured

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Residual Stresses and Differential Deformation of Electroplated Structures

Advances in X-ray Analysis ◽

10.1154/s0376030800019558 ◽

1989 ◽

Vol 33 ◽

pp. 161-169

Author(s):

G. Sheikh ◽

I. C. Noyan

Keyword(s):

Residual Stresses ◽

Lattice Parameter ◽

Stress Profile ◽

X Ray ◽

Residual Stress Profile ◽

Cyclic Loading And Unloading ◽

Nickel Substrates ◽

Loading And Unloading

AbstractWe report the results of a recent study where nickel substrates electroplated with chromium were loaded in-situ on an x-ray diffractometer. This technique allows determination of lattice spacings in the vicinity of the interface for both the film and the substrate as a function of the applied load. We used such lattice parameter data, SEM observations of the surface and x-ray peak breadth data to study the partitioning of deformation between the film and the substrate. The data indicates progressive loss of adhesion between the film and the substrate with increasing deformation. We observe significant effect of electroplating residual stresses on the mechanical behavior of the system. The loss of adhesion between the film and the substrate coupled with the initial residual stress profile causes an apparent 'negative Poisson's ratio' for the film during initial stages of the loading. This effect disappears with cyclic loading and unloading.

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Determination of stress-induced intrinsic birefringence in a single-mode fiber by measurement of the two-dimensional stress profile

Optics Letters ◽

10.1364/ol.27.001291 ◽

2002 ◽

Vol 27 (15) ◽

pp. 1291 ◽

Cited By ~ 16

Author(s):

Yongwoo Park ◽

Un-Chul Paek ◽

Dug Young Kim

Keyword(s):

Single Mode ◽

Single Mode Fiber ◽

Stress Profile ◽

Two Dimensional ◽

Intrinsic Birefringence

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Determination of Stress Profiles in Expanded Austenite by Combining Successive Layer Removal and GI-XRD

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.996.155 ◽

2014 ◽

Vol 996 ◽

pp. 155-161 ◽

Cited By ~ 6

Author(s):

Frederico Augusto Pires Fernandes ◽

Thomas L. Christiansen ◽

Marcel A.J. Somers

Keyword(s):

Lattice Parameter ◽

Free Lattice ◽

Stress Profile ◽

Residual Stress Profile ◽

Successive Layer ◽

Stress Profiles ◽

Expanded Austenite ◽

Successive Removal ◽

Good Agreement

The present work deals with the evaluation of the residual-stress profile in expanded-austenite by successive removal steps using GI-XRD. Preliminary results indicate stresses of several GPa's from 111 and 200 diffraction lines. These stresses appear largest for the 200 reflection. The strain-free lattice parameter decayed smoothly with depth, while for the compressive stress a maximum value is observed at some depth below the surface. Additionally a good agreement was found between the nitrogen profile determined with GDOES analysis and the strain-free lattice parameter from XRD.

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