Fabrication of Hydrophobic Ni Surface by Chemical Etching

Hydrophobic surfaces were successfully fabricated on pure nickel substrates by a one-step chemical etching process with different acidic solutions. The static water contact angle (SCA) of the etched Ni surfaces reached higher than 125°, showing excellent hydrophobicity. The examination of surface chemical compositions implied that there were almost no polar moieties on the surface after chemical etching, except part of the surface was oxidized. After chemical etching, the nickel surfaces became much rough with packed terrace-/crater-/thorn-like clusters. According to the analysis of surface composition and morphology, the hydrophobicity was evidently attributed to the rough microstructures on the etched Ni surface. The best hydrophobicity on Ni surface was produced with the SCAs as high as 140.0° by optimizing the etching time and etchants. The results demonstrate that it is possible to construct hydrophobic surfaces on hydrophilic substrates by tailoring the surface microstructure using a simple chemical etching process without any further hydrophobic modifications by low surface energy materials.

Growth Kinetics of the Selected Intermetallic Phases in Ni/Al/Ni System with Various Nickel Substrate Microstructure

Reactivity in nickel–aluminum system was examined for two variants of nickel substrates in terms of the size and shape of Ni grains. The microstructure transformation aroused due to the annealing at 720 °C for different annealing times (0.25 to 72 h) was consequently followed. The sequence of formation of the particular intermetallic phases was given. The interconnection zones were examined by means of scanning electron microscopy supported with energy dispersive X-ray spectroscopy and electron backscattered diffraction techniques as well as by the transmission electron microscopy. The growth kinetics data for AlNi, AlNiNi-rich and AlNi3 phases for both variants of substrates was given, indicating the differences obtained in previous works on this subject.

Predicting the preferred morphology of hexagonal boron nitride domain structure on nickel from ReaxFF-based molecular dynamics simulations

An understanding of the nucleation and growth of hexagonal boron nitride (hBN) on nickel substrates is essential to its development as a functional material.

A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish

Purpose The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research. Design/methodology/approach The EM process was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates. Findings Four types of intermetallic compounds (IMCs), namely, Cu-Sn, Cu3Sn, Cu6Sn5, and Sn-Bi, were detected between the Sn-Bi/Co solder joint. Voids appear to be at the anode and the cathode for 96 h of EM for Sn-Bi/Ni solder join; however, there seem to be more voids at the cathode. Originality/value EM is one of the crucial keys to produce a good integrated circuit (IC). When the current density is extremely high and will cause the metal ions to move into the electron direction flow, it will be characterised based on the ion flux density. In this research, the effect of EM on the Sn-Bi solder alloy joint on copper with nickel surface finish was studied.