Grinding and Polishing of Glass Surfaces

The paintings by the great Hungarian master Mihaly Munkacsy (1844-1900) made in an 8-9 years period of his activity are deteriorating. The most conspicuous sign of the deterioration is an intensive darkening. We have made an attempt by electron beam microanalysis to clarify the causes of the darkening. The importance of a study like this is increased by the fact that a similar darkening can be observed on the paintings by Munkacsy’s contemporaries e.g Courbet and Makart. A thick brown mass the so called bitumen used by Munkacsy for grounding and also as a paint is believed by the art historians to cause the darkening.For this study, paint specimens were taken from the following paintings: “Studio”, “Farewell” and the “Portrait of the Master’s Wife”, all of them are the property of the Hungarian National Gallery. The paint samples were embedded in a polyester resin “Poly-Pol PS-230” and after grinding and polishing their cross section was used for x-ray mapping.

Download Full-text

Glass Grinding and Polishing

Scientific American ◽

10.1038/scientificamerican05191917-308supp ◽

1917 ◽

Vol 83 (2159supp) ◽

pp. 308-310

Author(s):

James Weir French

Keyword(s):

Grinding And Polishing

Download Full-text

Acquired Factor XI Inhibitors in Two Patients with Hereditary Factor XI Deficiency

Thrombosis and Haemostasis ◽

10.1055/s-0038-1661104 ◽

1984 ◽

Vol 51 (03) ◽

pp. 371-375 ◽

Cited By ~ 10

Author(s):

Kangathevy Morgan ◽

Sandra Schiffman ◽

Donald Feinstein

Keyword(s):

Protein A ◽

Lambda Light Chain ◽

Factor Xi ◽

Spontaneous Bleeding ◽

Factor Xi Deficiency ◽

Hereditary Factor ◽

Coagulation Mechanism ◽

Factor Xia ◽

Polyclonal Igg ◽

Glass Surfaces

SummaryTwo patients with hereditary factor XI deficiency developed inhibitors following plasma transfusions. Neither had severe spontaneous bleeding. The patients’ plasmas neutralized both factor XI in plasma, purified factor XI, and purified factor XIa. The inhibitor in both patients’ plasmas adsorbed to Protein A- Sepharose. The inhibitors eluted from Protein A-Sepharose were partially neutralized by kappa and lambda light chain antisera indicating that they were polyclonal IgG antibodies. Both inhibitors markedly decreased adsorption of factor XI to glass surfaces. The cleavage of factor XI by trypsin was unaffected by the inhibitors. The lack of severe spontaneous bleeding in both of these patients strongly suggests that an alternate coagulation mechanism bypassing factor XI must compensate for this severe defect.

Download Full-text

Incorporation of Multi Wall Carbon Nanotubes into Glass-Surfaces via Laser-Treatment

MRS Proceedings ◽

10.1557/proc-772-m2.8 ◽

2003 ◽

Vol 772 ◽

Cited By ~ 1

Author(s):

T. Seeger ◽

G. de la Fuente ◽

W.K. Maser ◽

A.M. Benito ◽

A. Righi ◽

...

Keyword(s):

Carbon Nanotubes ◽

Continuous Wave ◽

Silica Surface ◽

Multi Wall Carbon Nanotubes ◽

Composite Formation ◽

Multi Walled Carbon Nanotubes ◽

Glass Surfaces ◽

Walled Carbon Nanotubes ◽

First Time ◽

Scanning Electron

AbstractCarbon nanotubes (CNT) are interesting candidates for the reinforcement in robust composites and for conducting fillers in polymers due to their fascinating electronic and mechanical properties. For the first time, we report the incorporation of multi walled carbon nanotubes (MWNTs) into silica-glass surfaces by means of partial surface-melting caused by a continuous wave Nd:YAG laser. MWNTs were detected being well incorporated in the silica-surface. The composites are characterized using scanning electron microscopy (SEM) and Raman-spectroscopy. A model for the composite-formation is proposed based on heatabsorption by MWNTs and a partial melting of the silica-surface.

Download Full-text

Electrical Invasiveness of Grinding and Polishing Silicon Integrated Circuits Down to 1 μm Remaining Silicon Thickness

ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2016p0166 ◽

2016 ◽

Author(s):

Robert Chivas ◽

Scott Silverman ◽

Michael DiBattista ◽

Ulrike Kindereit

Keyword(s):

Integrated Circuits ◽

Failure Analysis ◽

Electron Hole ◽

Analysis Techniques ◽

Silicon Integrated Circuits ◽

Electron Hole Pair ◽

Pair Generation ◽

Silicon Thickness ◽

Performance Timing ◽

Grinding And Polishing

Abstract Anticipating the end of life for IR-based failure analysis techniques, a method of global backside preparation to ultra-thin remaining silicon thickness (RST) has been developed. When the remaining silicon is reduced, some redistribution of stress is expected, possibly altering the performance (timing) of integrated circuits in addition to electron-hole pair generation. In this work, a study of the electrical invasiveness due to grinding and polishing silicon integrated circuits to ultra-thin (< 5 um global, ~ 1 um local) remaining thickness is presented.

Download Full-text