Atom Probe Tomography Characterization of Dopant Distributions in Si FinFET: Challenges and Solutions

2019 ◽  
Vol 26 (1) ◽  
pp. 36-45 ◽  
Author(s):  
Rong Hu ◽  
Jing Xue ◽  
Xingping Wu ◽  
Yanbo Zhang ◽  
Huilong Zhu ◽  
...  

AbstractAtom probe tomography (APT) has emerged as an important tool in characterizing three-dimensional semiconductor devices. However, the complex structure and hybrid nature of a semiconductor device can pose serious challenges to the accurate measurement of dopants. In particular, local magnification and trajectory aberration observed when analyzing hybrid materials with different evaporation fields can cause severe distortions in reconstructed geometry and uncertainty in local chemistry measurement. To address these challenges, this study systematically investigates the effect of APT sampling directions on the measurement of n-type dopants P and As in an Si fin field-effect transistor (FinFET). We demonstrate that the APT samples made with their Z-axis perpendicular to the center axis of the fin are effective to minimize the negative effects that result from evaporation field differences between the Si fin and SiO2 on reconstruction and achieve improved measurement of dopant distributions. In addition, new insights have been gained regarding the distribution of ion-implanted P and As in the Si FinFET.

2013 ◽  
Vol 6 (6) ◽  
pp. 066602 ◽  
Author(s):  
Hisashi Takamizawa ◽  
Katsuya Hoshi ◽  
Yasuo Shimizu ◽  
Fumiko Yano ◽  
Koji Inoue ◽  
...  

2013 ◽  
Vol 6 (4) ◽  
pp. 046502 ◽  
Author(s):  
Koji Inoue ◽  
Hisashi Takamizawa ◽  
Yasuo Shimizu ◽  
Fumiko Yano ◽  
Takeshi Toyama ◽  
...  

MRS Bulletin ◽  
2009 ◽  
Vol 34 (10) ◽  
pp. 738-743 ◽  
Author(s):  
Lincoln J. Lauhon ◽  
Praneet Adusumilli ◽  
Paul Ronsheim ◽  
Philip L. Flaitz ◽  
Dan Lawrence

AbstractThe development of laser-assisted atom-probe tomography (APT) analysis and new sample preparation approaches have led to significant advances in the characterization of semiconductor materials and device structures by APT. The high chemical sensitivity and three-dimensional spatial resolution of APT makes it uniquely capable of addressing challenges resulting from the continued shrinking of semiconductor device dimensions, the integration of new materials and interfaces, and the optimization of evolving fabrication processes. Particularly pressing concerns include the variability in device performance due to discrete impurity atom distributions, the phase and interface stability in contacts and gate dielectrics, and the validation of simulations of impurity diffusion. This overview of APT of semiconductors features research on metal-silicide contact formation and phase control, silicon field-effect transistors, and silicon and germanium nanowires. Work on silicide contacts to silicon is reviewed to demonstrate impurity characterization in small volumes and indicate how APT can facilitate defect mitigation and process optimization. Impurity contour analysis of a pFET semiconductor demonstrates the site-specificity that is achievable with current APTs and highlights complex device challenges that can be uniquely addressed. Finally, research on semiconducting nanowires and nanowire heterostructures demonstrates the potential for analysis of materials derived from bottom-up synthesis methods.


2013 ◽  
Vol 634-638 ◽  
pp. 2135-2139
Author(s):  
Yi Luo

The precipitation hardened steel 10Ni3MnCuAl after solution heat treatment and aging at 510 °C is investigated by three dimensional atom probe (3DAP). The results show that the Ni, Mn, Al and Cu distribute uniformly in the steel after solution heat treatment, but they form multicomponent precipitates after aging and cause the hardness increase. The concentration ratio between Ni and Al in multicomponent precipitates is roughly 1, while the concentration of Fe decreases, and the distance between concentration peak of Cu and those of Ni and Al becomes wider with the aging time, which is related to the precipitation character of Cu in α-ferrite.


2012 ◽  
Vol 463-464 ◽  
pp. 20-24
Author(s):  
Kai Zhao

More attention has been paid to the interfaces since mechanical properties of nickel-base superalloys are determined to some degree by them. The compositional transition across γ/γ′ interfaces and atomic structure of the interfaces was investigated using three-dimensional atom probe tomography and scanning transmission electron microscope equipped with high-resolution Energy Dispersive X-ray Spectrometry. Results show that no obvious segregation to the interfaces or ledges of the precipitates in the present experimental alloys has been observed. Also, adsorption of a solute to the interface was not observed. The interfaces are not flat as usually thought at an atomic scale. The interfacial thickness is about two atomic layers, i.e. 0.7 nm.


Sign in / Sign up

Export Citation Format

Share Document