Solid Electrolyte Interphase Layer Formation during Lithiation of Single-Crystal Silicon Electrodes with a Protective Aluminum Oxide Coating

Author(s):  
Arne Ronneburg ◽  
Luca Silvi ◽  
Joshaniel Cooper ◽  
Karsten Harbauer ◽  
Matthias Ballauff ◽  
...  
2017 ◽  
Vol 121 (47) ◽  
pp. 26233-26240 ◽  
Author(s):  
Feng Hao ◽  
Zhixiao Liu ◽  
Perla B. Balbuena ◽  
Partha P. Mukherjee

2012 ◽  
Vol 215 ◽  
pp. 145-151 ◽  
Author(s):  
Siva P.V. Nadimpalli ◽  
Vijay A. Sethuraman ◽  
Swapnil Dalavi ◽  
Brett Lucht ◽  
Michael J. Chon ◽  
...  

Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


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