scholarly journals Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Author(s):  
Andreas Nylander ◽  
Josef Hansson ◽  
Torbjörn Nilsson ◽  
Lilei Ye ◽  
Yifeng Fu ◽  
...  

Carbon ◽  
2019 ◽  
Vol 145 ◽  
pp. 725-733 ◽  
Author(s):  
Lin Qiu ◽  
Pu Guo ◽  
Qinyu Kong ◽  
Chong Wei Tan ◽  
Kun Liang ◽  
...  


Carbon ◽  
2017 ◽  
Vol 120 ◽  
pp. 128-136 ◽  
Author(s):  
Lin Qiu ◽  
Kimberly Scheider ◽  
Suhaib Abu Radwan ◽  
LeighAnn Sarah Larkin ◽  
Christopher Blair Saltonstall ◽  
...  




Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.



2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda


2012 ◽  
Vol 116 (6) ◽  
pp. 3903-3909 ◽  
Author(s):  
Hongyuan Chen ◽  
Minghai Chen ◽  
Jiangtao Di ◽  
Geng Xu ◽  
Hongbo Li ◽  
...  


2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).



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