Lead-Free All-Inorganic Cesium Tin Iodide Perovskite for Filamentary and Interface-Type Resistive Switching toward Environment-Friendly and Temperature-Tolerant Nonvolatile Memories

2019 ◽  
Vol 11 (8) ◽  
pp. 8155-8163 ◽  
Author(s):  
Ji Su Han ◽  
Quyet Van Le ◽  
Jaeho Choi ◽  
Hyojung Kim ◽  
Sun Gil Kim ◽  
...  
Keyword(s):  
Resistive Switching ◽  
Lead Free ◽  
Environment Friendly ◽  
Nonvolatile Memories ◽  
Tin Iodide ◽  
Interface Type

Impact of Hydroiodic Acid on Resistive Switching Performance of Lead-Free Cs3Cu2I5 Perovskite Memory

2021 ◽  
Vol 12 (7) ◽  
pp. 1973-1978
Author(s):  
Fanju Zeng ◽  
Yongqian Tan ◽  
Wei Hu ◽  
Xiaosheng Tang ◽  
Zhongtao Luo ◽  
...  
Keyword(s):  
Resistive Switching ◽  
Lead Free ◽  
Hydroiodic Acid ◽  
Switching Performance

Kinetics-Based Modeling of Bond-Metal Dissolution and IMC During Soldering

2006 ◽  
Author(s):  
Mohammad Faizan ◽  
Guo-X. Wang
Keyword(s):  
Intermetallic Phase ◽  
Molten Solder ◽  
Lead Free ◽  
Joint Interface ◽  
Environment Friendly ◽  
Soldering Process ◽  
Substrate Dissolution ◽  
Soldering Reaction ◽  
Lead Free Solders ◽  
Kinetics Of

Soldering has become an indispensable joining process in the electronic packaging industry. The industry is aiming for the use of environment friendly lead-free solders. All the lead-free solders are high tin-containing alloys. During the soldering process, an intense interaction of metallization on PCB and tin from the solder occurs at the metallization/solder interface. Intermetallic compound (IMC) is formed at the interface and subsequently PCB bond-metal (substrate) is dissolved into the molten solder. In the present study the terms bond-metal and substrate will be used interchangeably and the term 'substrate' refers to the top layer of the PCB which comes in contact with the molten solder during soldering reaction. Thickness of the intermetallic phase formed at the joint interface and amount of substrate lost is critical in achieving reliable solder joints. During the wet phase of soldering process, the IMC does not grow as layered structure; rather it takes the shape of scallops. The growth of scalloped IMC during the solder/substrate interaction entails complicated physics. Understanding of the actual kinetics involved in the formation of IMC phase is important in controlling the process to achieve desired results. This paper presents theoretical analysis of the kinetics involved in the formation of the scalloped intermetallic phase. The intermetallic phase growth is experimentally investigated to support the underlying kinetics of the process. Numerical model has been suggested to translate the physics of the process. The model is based on the basic mass diffusion equations and can predict the substrate dissolution and IMC thickness as a function of soldering time.

Study on the Lead-Free Easy-Cutting Mg-Sb Brass

2011 ◽  
Vol 239-242 ◽  
pp. 1670-1673 ◽  
Author(s):  
Lei Li ◽  
Biao Ma ◽  
Qiang Li ◽  
Guo Jie Huang
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Grain Boundaries ◽  
Human Health ◽  
Hot Working ◽  
Experimental Results ◽  
Lead Free ◽  
Environment Friendly ◽  
Working Property ◽  
Pipe Joint

Traditional lead brass is gradually prevented from application by many countries’ governments because lead does harm to human health and pollutes the environment. New types of environment-friendly lead-free brass with favorable machinability are urgently demanded in the electrical, electronics and plumping fields. Lead-free Mg-Sb brass was fabricated in present. Experimental results showed that when the content of Mg is 1.0wt%, Sb is 0.8wt% and Cu is 58.0~59.0wt%, the alloy’s mechanical properties and machinability are favorable for industry application. With the increase of the content of Sb, the machinability increased, while the mechanical properties decreased. Lots of Cu2Mg and Cu9Sb2 particles on the order of microns exist in the inner-grain and grain boundaries. These particles improve the machinability, however, lower the tensile strength and the elongation. A three-way pipe joint was successfully punched with the fabricated Mg-Sb brass bar, and this demonstrated that the fabricated Mg-Sb brass possesses favorable hot working property.

Structurally Stabilizing and Environment Friendly Triggers: Double‐Metallic Lead‐Free Perovskites

Solar RRL ◽  
2019 ◽  
Vol 3 (9) ◽  
pp. 1900148 ◽  
Author(s):  
Hang Yin ◽  
Yeming Xian ◽  
Yongli Zhang ◽  
Wenzhe Li ◽  
Jiandong Fan
Keyword(s):  
Lead Free ◽  
Environment Friendly ◽  
Metallic Lead

A distinct mutual phase transition in a new PVDF based lead-free composite film with enhanced dielectric and energy storage performance and low loss

2017 ◽  
Vol 5 (10) ◽  
pp. 2531-2541 ◽  
Author(s):  
Dong Guo ◽  
Kai Cai ◽  
Yunli Wang
Keyword(s):  
Phase Transition ◽  
Energy Storage ◽  
Polyvinylidene Fluoride ◽  
Composite Films ◽  
Lead Free ◽  
Low Loss ◽  
Ceramic Filler ◽  
Environment Friendly ◽  
High Permittivity ◽  
Storage Performance

Environment-friendly polyvinylidene fluoride (PVDF) based composite films were fabricated by using a high permittivity lead-free Ba(Sn,Ti)O3–(Ba,Ca)TiO3 (BCTS) ceramic filler with a special ‘tricritical’ phase structure.

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