scholarly journals Reactivation of non‐optimally orientated faults due to glacially induced stresses

Tectonics ◽  
2021 ◽  
Author(s):  
Rebekka Steffen ◽  
Holger Steffen
Keyword(s):  
Induced Stresses

Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

1972 ◽  
Vol 30 ◽  
pp. 524-525
Author(s):  
C. S. Giggins ◽  
J. K. Tien ◽  
B. H. Kear ◽  
F. S. Pettit
Keyword(s):  
Electron Microscopy ◽  
Oxide Scale ◽  
Oxidation Resistance ◽  
Substrate Surface ◽  
Morphological Features ◽  
Thermally Induced ◽  
Oxide Spallation ◽  
Oxidation Resistant ◽  
Induced Stresses ◽  
Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

Multi-disciplinary flow/thermal and induced stresses in convectively cooled structures

1995 ◽  
Author(s):  
Wai Poon ◽  
Ramdev Kanapady ◽  
Ram Mohan ◽  
Kumar Tamma
Keyword(s):  
Induced Stresses

Modelling Electromigration and Induced Stresses In Aluminum Lines

1993 ◽  
Vol 309 ◽  
Author(s):  
R. Kirchheim
Keyword(s):  
Beneficial Effect ◽  
General Equation ◽  
Concentration Profiles ◽  
Simple Explanation ◽  
Vacancy Model ◽  
Induced Stresses

AbstractThe various equations used by different authors for describing electromigration are compiled. All of them can be derived from a general equation which is based on a vacancy model. During the derivation of simplified versions of the general equations assumptions have to be made and their effect on concentration profiles and/or electromigration stresses developing as a function of time are discussed. Consequences with respect to Blech's experiment or the current exponent in Black's equation are taken into consideration and a simple explanation is provided for the beneficial effect of a (111) texture on the reliability of Al-lines.

Theory of Interdiffusion in Solids

2006 ◽  
Vol 258-260 ◽  
pp. 52-58
Author(s):  
Y.C. Chen
Keyword(s):  
Subject Matter ◽  
Phase Growth ◽  
Atomic Flux ◽  
The Subject ◽  
Induced Stresses ◽  
Volume Unit ◽  
The Relationship

Traditional theories of interdiffusion in solids based on Fick’s first and second laws and Darken’s equations can not describe the relationship between the diffusion fluxes and the diffusion-induced stresses, because the subject matter of the traditional theories is the diffusing atom or atomic flux, not the volume unit within the interdiffusion field. For this reason, it is suggested that the concept of flow point in the interdiffusion field should be constructed to describe the diffusion-induced stresses and the phase growth.

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

1991 ◽  
Vol 113 (3) ◽  
pp. 258-262 ◽  
Author(s):  
J. G. Stack ◽  
M. S. Acarlar
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Power Dissipation ◽  
Point Of View ◽  
Optical Data ◽  
Data Link ◽  
Element Analysis ◽  
Thermally Induced ◽  
Temperature Changes ◽  
Induced Stresses

The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes

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