Modelling Electromigration and Induced Stresses In Aluminum Lines

MRS Proceedings ◽

10.1557/proc-309-101 ◽

1993 ◽

Vol 309 ◽

Cited By ~ 18

Author(s):

R. Kirchheim

Keyword(s):

Beneficial Effect ◽

General Equation ◽

Concentration Profiles ◽

Simple Explanation ◽

Vacancy Model ◽

Induced Stresses

AbstractThe various equations used by different authors for describing electromigration are compiled. All of them can be derived from a general equation which is based on a vacancy model. During the derivation of simplified versions of the general equations assumptions have to be made and their effect on concentration profiles and/or electromigration stresses developing as a function of time are discussed. Consequences with respect to Blech's experiment or the current exponent in Black's equation are taken into consideration and a simple explanation is provided for the beneficial effect of a (111) texture on the reliability of Al-lines.

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Microstructures of Ti-1.5 w/o Ni Alloys with Mo and A1 Additions

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100113895 ◽

1975 ◽

Vol 33 ◽

pp. 54-55

Author(s):

Anna C. Fraker

Keyword(s):

Corrosion Resistance ◽

Beneficial Effect ◽

Crevice Corrosion ◽

Local Corrosion ◽

Precipitate Size ◽

Ni Alloys

Small amounts of nickel are added to titanium to improve the crevice corrosion resistance but this results in an alloy which has sheet fabrication difficulties and is subject to the formation of large Ti2Ni precipitates. These large precipitates can serve as local corrosion sites; but in a smaller more widely dispersed form, they can have a beneficial effect on crevice corrosion resistance. The purpose of the present work is to show that the addition of a small amount of Mo to the Ti-1.5Ni alloy reduces the Ti2Ni precipitate size and produces a more elongated grained microstructure. It has recently been reported that small additions of Mo to Ti-0.8 to lw/o Ni alloys produce good crevice corrosion resistance and improved fabrication properties.

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Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010009587x ◽

1972 ◽

Vol 30 ◽

pp. 524-525

Author(s):

C. S. Giggins ◽

J. K. Tien ◽

B. H. Kear ◽

F. S. Pettit

Keyword(s):

Electron Microscopy ◽

Oxide Scale ◽

Oxidation Resistance ◽

Substrate Surface ◽

Morphological Features ◽

Thermally Induced ◽

Oxide Spallation ◽

Oxidation Resistant ◽

Induced Stresses ◽

Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

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On the role of tin underlays for the prevention of thermal grooving in thin gold films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100145030 ◽

1986 ◽

Vol 44 ◽

pp. 732-733

Author(s):

Jin Young Kim ◽

R. E. Hummel ◽

R. T. DeHoff

Keyword(s):

Thin Film ◽

Free Surface ◽

Grain Boundary ◽

Beneficial Effect ◽

Failure Mechanism ◽

Failure Mechanisms ◽

Distinct Advantage ◽

Gold Films ◽

Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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