Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Scientific Reports ◽

10.1038/srep40785 ◽

2017 ◽

Vol 7 (1) ◽

Author(s):

Fei He ◽

Junjie Yu ◽

Yuanxin Tan ◽

Wei Chu ◽

Changhe Zhou ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bessel Beams ◽

Through Silicon Vias ◽

Download Full-text

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/22/5/055021 ◽

2012 ◽

Vol 22 (5) ◽

pp. 055021 ◽

Author(s):

Pradeep Dixit ◽

Tapani Vehmas ◽

Sami Vähänen ◽

Philippe Monnoyer ◽

Kimmo Henttinen

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Electrical Characterization ◽

Through Silicon Vias ◽

Poly Silicon ◽

Download Full-text

Enabling Continuous Cu Seed Layer for Deep Through-Silicon-Vias with High Aspect Ratio by Sequential Sputtering and Electroless Plating

IEEE Electron Device Letters ◽

10.1109/led.2021.3105667 ◽

2021 ◽

pp. 1-1

Author(s):

Ziyue Zhang ◽

Yingtao Ding ◽

Lei Xiao ◽

Ziru Cai ◽

Baoyan Yang ◽

...

Keyword(s):

Aspect Ratio ◽

Electroless Plating ◽

High Aspect Ratio ◽

Through Silicon Vias ◽

Download Full-text

High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2014.2369236 ◽

2015 ◽

Vol 5 (1) ◽

pp. 21-27 ◽

Author(s):

Simon J. Bleiker ◽

Andreas C. Fischer ◽

Umer Shah ◽

Nutapong Somjit ◽

Tommy Haraldsson ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

High Frequency ◽

Through Silicon Vias ◽

Magnetic Assembly ◽

High Frequency Application ◽

Download Full-text

Superconformal Bottom-up Nickel Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2016-02/19/1560 ◽

2016 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nickel Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

Download Full-text

Wafer-level wet etching of high-aspect-ratio through silicon vias (TSVs) with high uniformity and low cost for silicon interposers with high-density interconnect of 3D packaging

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159783 ◽

2015 ◽

Author(s):

Liyi Li ◽

Jiali Wu ◽

C. P. Wong

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Low Cost ◽

High Density ◽

Wet Etching ◽

Wafer Level ◽

Through Silicon Vias ◽

High Uniformity ◽

3D Packaging ◽

Download Full-text

Superconformal Bottom-up Nickel Deposition in High Aspect Ratio through Silicon Vias

ECS Transactions ◽

10.1149/07502.0019ecst ◽

2016 ◽

Vol 75 (2) ◽

pp. 19-24 ◽

Author(s):

D. Josell ◽

T. P. Moffat

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Nickel Deposition ◽

Bottom Up ◽

Through Silicon Vias ◽

Download Full-text

Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.30 ◽

2016 ◽

Author(s):

Liyi Li ◽

Guoping Zhang ◽

Chia-Chi Tuan ◽

Kyoung-Sik Moon ◽

Rong Sun

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Spin Coating ◽

Insulation Layer ◽

Through Silicon Vias ◽

Download Full-text

Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection

Journal of The Electrochemical Society ◽

10.1149/1945-7111/abd56e ◽

2020 ◽

Author(s):

Rebecca Pauline Schmitt ◽

Lyle Menk ◽

Ehren Baca ◽

John Eric Bower ◽

Joseph Romero ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Copper Electrodeposition ◽

Endpoint Detection ◽

Through Silicon Vias ◽

Wafer Thickness ◽

Download Full-text

Experimental study of current density in copper filling process within deep through-silicon vias with high aspect ratio

Journal of Micromechanics and Microengineering ◽

10.1088/1361-6439/ab3f3e ◽

2019 ◽

Vol 29 (12) ◽

pp. 125013

Author(s):

Feng Wang ◽

Fuliang Wang ◽

Ximei Liu ◽

Jinzhi Liu

Keyword(s):

Experimental Study ◽

Aspect Ratio ◽

Current Density ◽

High Aspect Ratio ◽

Filling Process ◽

Through Silicon Vias ◽

Download Full-text

Superconformal Bottom-up Cobalt Deposition in High Aspect Ratio through Silicon Vias

ECS Meeting Abstracts ◽

10.1149/ma2016-02/19/1561 ◽

2016 ◽

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Bottom Up ◽

Through Silicon Vias ◽

Silicon Vias ◽

Cobalt Deposition

Download Full-text