Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures
Keyword(s):
All the WPCB samples had similar structure, which comprises six layers of fiberglass (representing WPCB substrate), two copper foil layers (upper and lower layers), copper tracks, through-hole pads and two soldermask layers (upper and lower layers).
Keyword(s):
2017 ◽
Vol 24
(35)
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pp. 27445-27456
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2019 ◽
Vol 26
(22)
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pp. 22137-22146
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2017 ◽
Vol 26
(4)
◽
pp. 1311-1319
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Keyword(s):
2014 ◽
Vol 35
(21)
◽
pp. 2743-2751
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