scholarly journals SOI multimode waveguide bend with radially bridged SWGs for broadband (de)multiplexing -INVITED

2021 ◽  
Vol 255 ◽  
pp. 01003
Author(s):  
Kevan K. MacKayt ◽  
Winnie N. Ye

A novel broadband multimode waveguide bend is proposed that supports the propagation of multiple TE modes on a silicon-on-insulator platform. The gradient curvature bend utilizes trapezoidal subwavelength grating (SWG) segments, connected by adiabatically tapered radial strips to achieve efficient mode (de)multiplexing. The inclusion of the radial strips offers an extra degree of design freedom, allowing the realization of a multimode bend with only one single full etch step. The access waveguide has a width of 2.075 μm with an effective radius of 10 μm. Propagation loss for all modes remains below 2.96 dB, and intermodal crosstalk has a maximum of -19 dB across a broad bandwidth of 100 nm, centred at 1550 nm. This work presents an excellent design choice for broadband mode-division multiplexing operations.

2021 ◽  
Vol 15 (04) ◽  
Author(s):  
Juanli Wang ◽  
Shangsen Sun ◽  
Runsen Zhang ◽  
Fengchun Zhang ◽  
Ning Zhu

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 414
Author(s):  
Marta Maria Kluba ◽  
Jian Li ◽  
Katja Parkkinen ◽  
Marcus Louwerse ◽  
Jaap Snijder ◽  
...  

Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a novel cavity buried oxide (BOX) SOI substrate (cavity-BOX) that contains a patterned BOX layer. The patterned BOX can form a buried microchannels network, or serve as a stop layer and a buried hard-etch mask, to accurately pattern the device layer while etching it from the backside of the wafer using the cleanroom microfabrication compatible tools and methods. The use of the cavity-BOX as a buried hard-etch mask is demonstrated by applying it for the fabrication of a deep brain stimulation (DBS) demonstrator. The demonstrator consists of a large flexible area and precisely defined 80 µm-thick silicon islands wrapped into a 1.4 mm diameter cylinder. With cavity-BOX, the process of thinning and separating the silicon islands was largely simplified and became more robust. This test case illustrates how cavity-BOX wafers can advance the fabrication of various MEMS devices, especially those with complex geometry and added functionality, by enabling more design freedom and easing the optimization of the fabrication process.


2018 ◽  
Vol 32 (31) ◽  
pp. 1850344 ◽  
Author(s):  
N. Eti ◽  
Z. Çetin ◽  
H. S. Sözüer

A detailed numerical study of low-loss silicon on insulator (SOI) waveguide bend is presented using the fully three-dimensional (3D) finite-difference time-domain (FDTD) method. The geometrical parameters are optimized to minimize the bending loss over a range of frequencies. Transmission results for the conventional single bend and photonic crystal assisted SOI waveguide bend are compared. Calculations are performed for the transmission values of TE-like modes where the electric field is strongly transverse to the direction of propagation. The best obtained transmission is over 95% for TE-like modes.


2018 ◽  
Vol 26 (23) ◽  
pp. 29873 ◽  
Author(s):  
Luhua Xu ◽  
Yun Wang ◽  
Amar Kumar ◽  
Eslam El-Fiky ◽  
Deng Mao ◽  
...  

2014 ◽  
Vol 39 (15) ◽  
pp. 4442 ◽  
Author(s):  
J. Gonzalo Wangüemert-Pérez ◽  
Pavel Cheben ◽  
Alejandro Ortega-Moñux ◽  
Carlos Alonso-Ramos ◽  
Diego Pérez-Galacho ◽  
...  

2007 ◽  
Vol 15 (2) ◽  
pp. 669 ◽  
Author(s):  
Ioannis Papakonstantinou ◽  
Kai Wang ◽  
David R. Selviah ◽  
F. Aníbal Fernández

2010 ◽  
Vol 18 (19) ◽  
pp. 20251 ◽  
Author(s):  
Przemek J. Bock ◽  
Pavel Cheben ◽  
Jens H. Schmid ◽  
Jean Lapointe ◽  
André Delâge ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document