scholarly journals Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

2016 ◽  
Vol 78 ◽  
pp. 01064
Author(s):  
M.I.I. Ramli ◽  
M.A.A. Mohd Salleh ◽  
M.N. Derman ◽  
R.M. Said ◽  
N. Saud
2015 ◽  
Vol 754-755 ◽  
pp. 551-555 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.


1994 ◽  
Vol 27 (8) ◽  
pp. 1904-1907
Author(s):  
Toshimi Umeno ◽  
Tsurayuki Shinohara ◽  
Shinnosuke Tanaka ◽  
Zentaro Shirai ◽  
Hiroshi Kimura ◽  
...  

Author(s):  
Mario Shimada ◽  
Shoji Natsugoe ◽  
Toru Kumanohoso ◽  
Takashi Aikou ◽  
Hisaaki Shimazu ◽  
...  

2019 ◽  
Vol 158 ◽  
pp. 2152-2157 ◽  
Author(s):  
Yuji Nakamura ◽  
Hiroki Yoshitome ◽  
Takuya Yamazaki ◽  
Tsuneyoshi Matsuoka ◽  
Jian Gao

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