High‐performance pressure sensors using double silicon‐on‐insulator structures

1991 ◽  
Vol 62 (5) ◽  
pp. 1341-1346 ◽  
Author(s):  
Gwiy‐Sang Chung ◽  
Shoji Kawahito ◽  
Makoto Ishida ◽  
Tetsuro Nakamura ◽  
Mitsuo Kawashima ◽  
...  
2019 ◽  
Vol 7 (4) ◽  
pp. 1022-1027 ◽  
Author(s):  
Tongkuai Li ◽  
Longlong Chen ◽  
Xiang Yang ◽  
Xin Chen ◽  
Zhihan Zhang ◽  
...  

High-performance pressure sensors have attracted considerable attention recently due to their promising applications in touch displays, wearable electronics, human–machine interfaces, and real-time physiological signal perception.


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Hongqiu Wei ◽  
Ming Lei ◽  
Ping Zhang ◽  
Jinsong Leng ◽  
Zijian Zheng ◽  
...  

Abstract3D-printing tough conductive hydrogels (TCHs) with complex structures is still a challenging task in related fields due to their inherent contrasting multinetworks, uncontrollable and slow polymerization of conductive components. Here we report an orthogonal photochemistry-assisted printing (OPAP) strategy to make 3D TCHs in one-pot via the combination of rational visible-light-chemistry design and reliable extrusion printing technique. This orthogonal chemistry is rapid, controllable, and simultaneously achieve the photopolymerization of EDOT and phenol-coupling reaction, leading to the construction of tough hydrogels in a short time (tgel ~30 s). As-prepared TCHs are tough, conductive, stretchable, and anti-freezing. This template-free 3D printing can process TCHs to arbitrary structures during the fabrication process. To further demonstrate the merits of this simple OPAP strategy and TCHs, 3D-printed TCHs hydrogel arrays and helical lines, as proofs-of-concept, are made to assemble high-performance pressure sensors and a temperature-responsive actuator. It is anticipated that this one-pot rapid, controllable OPAP strategy opens new horizons to tough hydrogels.


2019 ◽  
Vol 4 (5) ◽  
pp. 1800640 ◽  
Author(s):  
Songjia Han ◽  
Chunrui Liu ◽  
Zhaobin Huang ◽  
Jiwen Zheng ◽  
Huihua Xu ◽  
...  

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 414
Author(s):  
Marta Maria Kluba ◽  
Jian Li ◽  
Katja Parkkinen ◽  
Marcus Louwerse ◽  
Jaap Snijder ◽  
...  

Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a novel cavity buried oxide (BOX) SOI substrate (cavity-BOX) that contains a patterned BOX layer. The patterned BOX can form a buried microchannels network, or serve as a stop layer and a buried hard-etch mask, to accurately pattern the device layer while etching it from the backside of the wafer using the cleanroom microfabrication compatible tools and methods. The use of the cavity-BOX as a buried hard-etch mask is demonstrated by applying it for the fabrication of a deep brain stimulation (DBS) demonstrator. The demonstrator consists of a large flexible area and precisely defined 80 µm-thick silicon islands wrapped into a 1.4 mm diameter cylinder. With cavity-BOX, the process of thinning and separating the silicon islands was largely simplified and became more robust. This test case illustrates how cavity-BOX wafers can advance the fabrication of various MEMS devices, especially those with complex geometry and added functionality, by enabling more design freedom and easing the optimization of the fabrication process.


2020 ◽  
Vol 12 (52) ◽  
pp. 58403-58411
Author(s):  
Young-Ryul Kim ◽  
Minsoo P. Kim ◽  
Jonghwa Park ◽  
Youngoh Lee ◽  
Sujoy Kumar Ghosh ◽  
...  

Author(s):  
Xiyao Fu ◽  
Depeng Wang ◽  
Lili Wang ◽  
Hao Xu ◽  
Valerii Shulga ◽  
...  

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