Determination of Pore-Size Distributions in Low-k Dielectric Films by Transmission Electron Microscopy

Author(s):  
Brendan J. Foran
2011 ◽  
Vol 295-297 ◽  
pp. 1414-1417
Author(s):  
Zhi Fang Zhang ◽  
Fang Yan Du ◽  
Xiang Rong Ma

The nanocrystals Ce0.5Zr0.5O2 solid solutions with various morphologies and crystal structures have been synthesized via a modified sol-gel method assisted with a template. Aerosol OT and/or ionic liquids ([MMIM]Cl] and [BMIM]Cl]) was used as a template. The characterization results of the X-ray diffraction, transmission electron microscopy and N2 adsorption at 77 K indicate that the physical properties of the solid solutions were significantly affected by the templates used and the calcination temperatures. The Ce0.5Zr0.5O2 calcined at 773 K possessed bimodal mesopores, narrow pore size distributions, and tetragonal phase.


2008 ◽  
Vol 41 (3) ◽  
pp. 615-627 ◽  
Author(s):  
N. C. Popa ◽  
D. Balzar

A new anisotropic size-broadening model based on a spherical-harmonics representation allowing determination of both volume- and area-averaged apparent crystallites and convenient for implementation into Rietveld programs is described. The model effectiveness is demonstrated on a ZnO powder pattern exhibiting strongly anisotropic size broadening and pronounced super-Lorentzian peak shapes. Moreover, it is shown how the apparent crystallites can be interpreted in terms of physical models by using ellipsoidal and cylindrical crystallites with lognormal size distributions. This interpretation is critically assessed and it is argued that both simplified physical models anda prioricomplementary information (obtained by transmission electron microscopy, for instance) are often needed to avoid unstable and non-unique solutions.


Author(s):  
Dongmei Meng ◽  
Laura Buck ◽  
James Cargo

Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.


2009 ◽  
Vol 15 (S2) ◽  
pp. 134-135 ◽  
Author(s):  
C Phatak ◽  
E Humphrey ◽  
M DeGraef ◽  
A Petford-Long

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009


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