Circuit‐theoretic treatment for anisotropic elastic waveguides and its application to the design of nonreciprocal thin‐film acoustic devices using magnetoelastic material YIG

1977 ◽  
Vol 48 (8) ◽  
pp. 3263-3269
Author(s):  
M. Sugimoto ◽  
T. Makimoto
Wave Motion ◽  
2016 ◽  
Vol 64 ◽  
pp. 13-33 ◽  
Author(s):  
Vahan Baronian ◽  
Anne-Sophie Bonnet-Ben Dhia ◽  
Sonia Fliss ◽  
Antoine Tonnoir

2002 ◽  
Vol 750 ◽  
Author(s):  
Hanchen Huang ◽  
H. L. Wei ◽  
H. Y. Liang ◽  
C. H. Woo ◽  
X. X. Zhang

ABSTRACTIn this paper, we present a preliminary study of texture development during copper thin film deposition. Using direct current (DC) magnetron sputtering technique, we deposit copper films on a SiO2/Si(111) substrate. A thin layer of copper of <111> texture first develops, and another thin layer of <110> ensues. As deposition continues, a third layer of copper of <111> texture forms on the top, leading to a copper thin film of alternating <111> and <110> textures. The multiple layers of copper thin films of alternating textures form during continuous deposition without changing deposition conditions. The film morphology is characterized with scanning electron microscopy (SEM) and atomic force microscopy (AFM), and the texture with X-ray diffraction (XRD). Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.


2005 ◽  
Vol 875 ◽  
Author(s):  
Hirotsugu Ogi ◽  
Nobutomo Nakamura ◽  
Hiroshi Tanei ◽  
Masahiko Hirao

AbstractThis paper presents two advanced acoustic methods for the determination of anisotropic elastic constants of deposited thin films. They are resonant-ultrasound spectroscopy with laser-Doppler interferometry (RUS/Laser method) and picosecond-laser ultrasound method. Deposited thin films usually exhibit elastic anisotropy between the film-growth direction and an in-plane direction, and they show five independent elastic constants denoted by C11,C33,C44,C66 and C13 when the x3 axis is set along the film-thickness direction. The former method determines four moduli except C44, the out-of-plane shear modulus, through free-vibration resonance frequencies of the film/substrate specimen. This method is applicable to thin films thicker than about 200 nm. The latter determines C33, the out-of-plane modulus, accurately bymeasuring the round-trip time of the longitudinal wave traveling along the film-thickness direction. This method is applicable to thin films thicker than about 20 nm. Thus, combination of these two methods allows us to discuss the elastic anisotropy of thin films. The results for Co/Pt superlattice thin film and copper thin film are presented.


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