Temperature distributions in a heat dissipation system using a cylindrical diamond heat spreader on a copper heat sink

1994 ◽  
Vol 75 (2) ◽  
pp. 748-757 ◽  
Author(s):  
P. Hui ◽  
H. S. Tan
Author(s):  
Y. C. Wu ◽  
H. T. Chen ◽  
C. C. Lin ◽  
Y. H. Hung

An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly are investigated. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.


2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Atul Nagose ◽  
Ankit Somani ◽  
Aviral Shrot ◽  
Arunn Narasimhan

Using an approach that couples genetic algorithm (GA) with conventional numerical simulations, optimization of the geometric configuration of a phase-change material based heat sink (PBHS) is performed in this paper. The optimization is done to maximize the sink operational time (SOT), which is the time for the top surface temperature of the PBHS to reach the critical electronics temperature (CET). An optimal solution for this complex multiparameter problem is sought using GA, with the standard numerical simulation seeking the SOT forming a crucial step in the algorithm. For constant heat dissipation from the electronics (constant heat flux) and for three typical PBHS depths (A), predictive empirical relations are deduced from the GA based simulation results. These correlations relate the SOT to the amount of phase change material to be used in the PBHS (φ), the PBHS depth (A), and the heat-spreader thickness (s), a hitherto unconsidered variable in such designs, to the best of the authors’ knowledge. The results show that for all of the typical PBHS depths considered, the optimal heat-spreader thickness is 2.5% of the PBHS depth. The developed correlations predict the simulated results within 4.6% for SOT and 0.32% for ϕ and empowers one to design a PBHS configuration with maximum SOT for a given space restriction or the most compact PBHS design for a given SOT.


2014 ◽  
Vol 554 ◽  
pp. 241-245 ◽  
Author(s):  
Mohd Bin Sulaiman Hafis ◽  
Mohd Jamir Mohd Ridzuan ◽  
Ahamad Zaidi Ahmad Firdaus ◽  
S.M. Shahril ◽  
Ramli Nur Farahana ◽  
...  

This paper presents theoretical and experimental works on the effect of heat transfer for a thermoelectric (TE) cooling system. The study focuses on thermal performance of the system through the optimisation of heat dissipation system for two prototypes that have aluminium and copper heat sink design, respectively. The study revealed that heat sink base area and fin height influenced thermal performance.


2013 ◽  
Vol 594-595 ◽  
pp. 1122-1125
Author(s):  
Mohd Bin Sulaiman Hafis ◽  
Mohd Jamir Mohd Ridzuan ◽  
Ahamad Zaidi Ahmad Firdaus ◽  
S.M. Shahril ◽  
R.N. Farahana ◽  
...  

This paper presents theoretical and experimental research works on the effect of aluminium heat sink and heat dissipation in a portable thermoelectric (TE) cooling system. In this study, three units of TE modules were utilized with an inputs of 3 A and 8 V. The aluminium heat sink was used to spread the heat generated by TE modules through its fins and surface area. The cold temperature was spread through by an aluminium cold sink with direct blow to the cooling space. The air flow rate was accelerated by the use of centrifugal blower on both sides of the heat dissipation system. The temperature of the cooling space caused was examined. The performance of TE module with the utilization of hot and cold sinks has shown that a greater heat dissipation rate was achieved.


2000 ◽  
Author(s):  
Brian Leonhardt ◽  
Aaron Webb ◽  
W. Bowman

Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.


Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


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