Infrared studies of room temperature deposition of hydrogenated silicon oxide films in rf magnetron discharges

1995 ◽  
Vol 78 (5) ◽  
pp. 3342-3347 ◽  
Author(s):  
Tien‐I Bao ◽  
Ming‐Shing Wu ◽  
Lin I
2001 ◽  
Vol 146-147 ◽  
pp. 451-456 ◽  
Author(s):  
Katsuya Teshima ◽  
Yasushi Inoue ◽  
Hiroyuki Sugimura ◽  
Osamu Takai

1998 ◽  
Vol 83 (2) ◽  
pp. 1107-1113 ◽  
Author(s):  
Ching-Fa Yeh ◽  
Tai-Ju Chen ◽  
Ching-Lin Fan ◽  
Jiann-Shiun Kao

2010 ◽  
Vol 159 ◽  
pp. 163-166 ◽  
Author(s):  
S. Alexandrova ◽  
A. Szekeres

In the present paper we discuss the defects at the oxide/Si interface and the structure of silicon oxide films grown on plasma hydrogenated (100) and (111)Si. The effect of oxide thickness ranging from 7 to 40 nm on the interface parameters was examined. Electrically active defects were characterized through C-V and G-V measurements. The dependence of the refractive index on oxide thickness was studied. Information on the oxide structure was inferred through the refractive index evaluated from ellipsometric measurements. From both, the electrical and optical results a characteristic oxide thickness was found, below which the oxide structure is different from SiO2, most probably SiOх. It is related to a modified Si surface during the pre-oxidation plasma treatment and its value depends on Si orientation and pre-clean conditions. A characteristic oxide thickness of 13 nm was found for Si hydrogenated without heating and, of 9 nm for Si hydrogenated at 300oC.


1992 ◽  
Vol 282 ◽  
Author(s):  
K. Hochberg ◽  
David A. Roberts

ABSTRACTA precursor for the LPCVD of silicon oxide films has been developed that extends the low temperature deposition range to 100°C. The chemical, 1,4 disilabutane (DSB), produces silicon oxide depositions similar to those of the higher temperature silane and diethylsilane (DES) processes. Optimum DSB processes require pressures below 300 mTorr, similar to silane, in contrast to DES pressures above 600 mTorr at 350°C. This results in poorer conformalities than those of DES, but the step coverages are still superior to those from silane oxides. The DSB films are low stress, carbon-free oxide layers that are suitable for temperature-sensitive underlayers and substrates such as photoresist, plastics, GaAs, and HgCdTe.


1996 ◽  
Vol 281-282 ◽  
pp. 348-351
Author(s):  
Hiroki Takahashi ◽  
Akihiro Nishiguchi ◽  
Hirotoshi Nagata ◽  
Haruki Kataoka ◽  
Masahide Fujishima

2011 ◽  
Vol 98 (25) ◽  
pp. 252903 ◽  
Author(s):  
Flora M. Li ◽  
Bernhard C. Bayer ◽  
Stephan Hofmann ◽  
James D. Dutson ◽  
Steve J. Wakeham ◽  
...  

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