Mapping two-dimensional arsenic distributions in silicon using dopant-selective chemical etching technique

1997 ◽  
Vol 82 (11) ◽  
pp. 5811-5815 ◽  
Author(s):  
Suneeta S. Neogi ◽  
David Venables ◽  
Zhiyong Ma ◽  
Dennis M. Maher ◽  
Mitchell Taylor ◽  
...  
2005 ◽  
Vol 152 (4) ◽  
pp. G277 ◽  
Author(s):  
S. Scalese ◽  
A. La Magna ◽  
M. Italia ◽  
S. Pannitteri ◽  
V. Privitera ◽  
...  

1997 ◽  
Vol 490 ◽  
Author(s):  
Kwang-Ki Choi ◽  
Tae-Yeon Seong ◽  
Seonghoon Lee ◽  
Hyunsang Hwang ◽  
Yong Sun Sohn

ABSTRACTSelective chemical etching and atomic force microscope (AFM) examination has been performed to delineate two-dimensional (2-D) dopants profiles of p/n-type well and junction areas. Selectivity strongly depended on the types of dopants and the ratio of etching solutions. Calibration showed that the carrier concentrations in both p/n-type regions could be delineated down to a level of ∼1×1017/cm3. The AFM-induced profiles were compared with the calculated data provided by the 2-D process simulators such as TRIM and SUPREM-IV.


2008 ◽  
Vol 2008 ◽  
pp. 1-4 ◽  
Author(s):  
Shigeki Matsuo ◽  
Kensuke Tokumi ◽  
Takuro Tomita ◽  
Shuichi Hashimoto

We applied the femtosecond laser-assisted etching technique, that is, irradiation of focused femtosecond laser pulses followed by selective chemical etching, to volume removal inside sapphire. At room temperature, volume etching only slightly advanced while residue remained inside the volume. By increasing the etching temperature, complete volume etching without residue was achieved. Complete etching was, however, accompanied by undesirable phenomena of surface pits or cracks, which are expected to be excluded through further improvement of processing.


2004 ◽  
Vol 36 (1-3) ◽  
pp. 353-358 ◽  
Author(s):  
G. Wisz ◽  
T.Ya. Gorbach ◽  
P.S. Smertenko ◽  
A. Blahut ◽  
K. Zembrowska ◽  
...  

2019 ◽  
Vol 6 (1) ◽  
pp. 99-103
Author(s):  
Peng Chen ◽  
Dapeng Xu ◽  
Luke Mawst ◽  
Kimmo Henttinen ◽  
Tommi Suni ◽  
...  

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