Remote thermal imaging with 0.7‐μm spatial resolution using temperature‐dependent fluorescent thin flims

1983 ◽  
Vol 42 (1) ◽  
pp. 117-119 ◽  
Author(s):  
Paul Kolodner ◽  
J. Anthony Tyson
Author(s):  
Robert Wright ◽  
Paul Lucey ◽  
Miguel Nunes ◽  
Sarath Gunapala ◽  
Sir Rafol ◽  
...  

2007 ◽  
Vol 1022 ◽  
Author(s):  
Gilles Tessier ◽  
Mathieu Bardoux ◽  
Céline Filloy ◽  
Danièle Fournier

AbstractThermoreflectance is an non contact optical method using the local reflectivity variations induced by heating to infer temperature mappings, and can be conducted at virtually any wavelength. In the visible, the technique is now well established. It can probe temperatures through several micrometers of transparent encapsulation layers, with sub-micron spatial resolution and 100 mK thermal resolution. In the ultraviolet range, dielectric encapsulation layers are opaque and thermoreflectance gives access to the surface temperature. In the near infrared, thermoreflectance is an interesting solution to examine chips turned upside down, since these wavelengths can penetrate through silicon substrates and give access to the temperature of the active layers themselves. Here, we explore the possibilities of each wavelength range and detail the CCD-based thermal imaging tools dedicated to the high resolution inspection of integrated circuits.


2007 ◽  
Vol 90 (17) ◽  
pp. 171112 ◽  
Author(s):  
G. Tessier ◽  
M. Bardoux ◽  
C. Boué ◽  
C. Filloy ◽  
D. Fournier

Author(s):  
Scott Smith ◽  
Bethany A. Woody ◽  
David A. Tursky ◽  
William E. Barkman

The creation of oscillating tool paths for turning operations that use the numerically controlled machine axes to ensure reliable chip breaking has been demonstrated in a variety of materials. The interrupted cuts created in this way have the additional benefit of allowing the temperature of the tool-chip interface to be controlled at a significantly lower level than in conventional turning. In traditional continuous turning, the interface temperature rises to a high level and stays there during machining. This is especially a problem for difficult-to-machine materials, because many tool wear mechanisms are strongly temperature dependent. In the chip breaking tool paths, the axes of the machine are used to oscillate the tool along the programmed tool path and before the temperature has a chance to rise to damaging levels, the cut can be interrupted so that the tool can cool. This is analogous to the technique of using shallow radial depths of cut in milling operations for difficult-to-machine materials. In this work, a thermal imaging camera is used to verify that this strategy can be effective in the machining of steel. The results from the thermal imaging studies show that over a broad range of conditions, oscillating tools paths create lower temperatures at the tool-chip interface.


2021 ◽  
Author(s):  
Tatsuaki Okada ◽  
Satoshi Tanaka ◽  
Naoya Sakatani ◽  
Yuri Shimaki ◽  
Takehiko Arai ◽  
...  

<p>The thermal infrared imager TIRI onboard the ESA Hera spacecraft is being developed to investigate thermophysical properties of the S-type asteroid 65803 Didymos and its moon Dimorphos by mapping thermal inertia and compositional variations of them. TIRI is based on an uncooled micro-bolometer array of 1024 x 768 effective pixels and covers the field of view of 13.3° x 10.0°, with the resolution of 0.23 mrad per pixel. TIRI has an eight-position filter wheel to be used as one wide bandpath at 8-14 µm for thermal imaging, six narrow bands peaked at 7.8, 8.6, 9.6, 10.6, 11.65, and 13.1 µm for compositional information, and one closed plate both for a shutter and a temperature reference.</p> <p>TIRI will be mounted on the top panel of the Hera spacecraft to point the target asteroids in the same direction with other instruments AFC, PALT, and Hyperscout-H, for the simultaneous observations. The asteroid surface temperature will change day and night according to thermal inertia and roughness of the surface layer, which will be consequently derived from the diurnal temperature profile. The maximum temperature in a day will also change according to the solar distance of the asteroid from ~1 to ~2 au at the beginning to the end of the nominal mission. During the early characterization phase (ECP) at 20 to 30 km from the asteroid, TIRI will take images from large solar phase angles from 50° to 70° with the spatial resolution of ~4.6 to 6.9 m per pixel to construct the asteroid shape model even in the night side and map the thermal inertia and composition. During the detailed characterization phase (DCP) at 10 to 20 km from the asteroid, TIRI will take images from the noon with the spatial resolution of ~2.3 m per pixel for more detailed thermal properties and compositional mapping. During the close-up operation phase (COP) at < 5 km from the asteroid, TIRI will take images from the noon with the spatial resolution of ~1 m per pixel. Higher spatial resolution will be achieved during the further close observations.</p> <p>In the Hayabusa2 mission, thermal imaging has revealed the highly porous nature of C-type asteroid from global to local scales (Okada et al, 2020; Shimaki et al, 2020), but nobody knows the surface properties of S-type asteroids so that this is a unique opportunity to investigate the S-type asteroid Didymos in comparison with the C-type asteroid Ryugu. For the moon Dimorphos, it will be the smallest asteroid ever explored so that it is also a unique opportunity to investigate the small-sized asteroid, especially for the strength and porosity. TIRI will contribute to verifying Yarkovsky and YORP (B-YORP) effects, orbital and rotational evolution in relation to thermophysical modeling. The temperature profile and compositional difference between the inside and outside of the artificial crater formed by the kinetic impact of the NASA DART spacecraft will be the important target both for the purpose of planetary defense and science.</p>


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