High Resolution Thermal Imaging of Integrated Circuits

2007 ◽  
Vol 1022 ◽  
Author(s):  
Gilles Tessier ◽  
Mathieu Bardoux ◽  
Céline Filloy ◽  
Danièle Fournier
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Spatial Resolution ◽  
Thermal Imaging ◽  
Optical Method ◽  
Near Infrared ◽  
Silicon Substrates ◽  
Active Layers ◽  
Ultraviolet Range ◽  
Interesting Solution

AbstractThermoreflectance is an non contact optical method using the local reflectivity variations induced by heating to infer temperature mappings, and can be conducted at virtually any wavelength. In the visible, the technique is now well established. It can probe temperatures through several micrometers of transparent encapsulation layers, with sub-micron spatial resolution and 100 mK thermal resolution. In the ultraviolet range, dielectric encapsulation layers are opaque and thermoreflectance gives access to the surface temperature. In the near infrared, thermoreflectance is an interesting solution to examine chips turned upside down, since these wavelengths can penetrate through silicon substrates and give access to the temperature of the active layers themselves. Here, we explore the possibilities of each wavelength range and detail the CCD-based thermal imaging tools dedicated to the high resolution inspection of integrated circuits.

scholarly journals High-Resolution Thermal Imaging and Analysis of TIG Weld Pool Phase Transitions

Sensors ◽  
2020 ◽  
Vol 20 (23) ◽  
pp. 6952
Author(s):  
Nicholas Boone ◽  
Matthew Davies ◽  
Jon Raffe Willmott ◽  
Hector Marin-Reyes ◽  
Richard French
Keyword(s):  
Phase Transitions ◽  
High Resolution ◽  
Weld Pool ◽  
Thermal Imaging ◽  
Near Infrared ◽  
Imaging System ◽  
Travel Speed ◽  
Tig Welding ◽  
Infrared Radiance ◽  
Wide Range

Tungsten inert gas (TIG) welding is a well-established joining process and offers the user flexibility to weld a large range of materials. Ultra-thin turbine tipping is an important application for TIG welding that is exceptionally challenging due to the wide range of variables needed to accurately control the process: slope times, arc control, travel speed, etc. We offer new insight into weld pool characteristics, utilizing both on- and off-line measurements of weld tracks. High-resolution thermal imaging yields spatially and temporally resolved weld pool phase transitions coupled with post-weld photographs, which gives a novel perspective into the thermal history of a weld. Our imaging system is filtered to measure a 10 nm window at 950 nm and comprises a commercial Sigma lens to produce a near-infrared (NIR) camera. The measured near-infrared radiance is calibrated for temperature over the range of from 800 to 1350 °C.

Back side thermal imaging of integrated circuits at high spatial resolution

2007 ◽  
Vol 90 (17) ◽  
pp. 171112 ◽  
Author(s):  
G. Tessier ◽  
M. Bardoux ◽  
C. Boué ◽  
C. Filloy ◽  
D. Fournier
Keyword(s):  
Integrated Circuits ◽  
Spatial Resolution ◽  
Thermal Imaging ◽  
High Spatial Resolution ◽  
Back Side

scholarly journals High Resolution Scanning of Radial Strips cut from Increment Cores by Near Infrared Spectroscopy

IAWA Journal ◽  
2007 ◽  
Vol 28 (4) ◽  
pp. 473-484 ◽  
Author(s):  
P. David Jenes ◽  
Laurence R. Schimleck ◽  
Chi-Leung So ◽  
Alexander Clark III ◽  
Richard F. Daniels
Keyword(s):  
Infrared Spectroscopy ◽  
High Resolution ◽  
Spatial Resolution ◽  
Near Infrared Spectroscopy ◽  
Near Infrared ◽  
High Spatial Resolution ◽  
Microfibril Angle ◽  
Wood Property ◽  
Nir Spectroscopy ◽  
Wood Properties

Near infrared (NIR) spectroscopy provides a rapid method for the determination ofwood properties of radial strips. The spatial resolution of the NIR measurements has generally been limited to sections 10mm wide and as a consequence the estimation of wood properties of individual rings or within rings has not been possible. Many different NIR instruments can be used to collect NIR spectra from the surface of radial strips at relatively high spatial resolution and the purpose of this study was to compare wood property calibrations obtained using NIR spectra collected in 5 mm and 2 mm seetions with several different NIR instruments. We found that calibrations based on spectra collected in 5 mm seetions had good statistics, with those based on the Bruker Vector 22/N spectrometer the strongest. Of the three properties examined (density, microfibril angle and stiffness), density had the weakest statistics. When the spatial resolution was decreased to 2 mm, calibration and prediction statistics were weaker than those at 5 mm. RPDp's were relatively low with the highest being 1.76 for predicted stiffness based on NIR spectra obtained using the ASD Field Spec Pro spectrometer. Based on the low RPDp's, we conclude that none of the instruments examined were suitable for scanning radial strips at a spatial resolution of 2 mm.

scholarly journals A Long-Term, High-Resolution Wetland Dataset over the Amazon Basin, Downscaled from a Multiwavelength Retrieval Using SAR Data

2013 ◽  
Vol 14 (2) ◽  
pp. 594-607 ◽  
Author(s):  
Filipe Aires ◽  
Fabrice Papa ◽  
Catherine Prigent
Keyword(s):  
High Resolution ◽  
Spatial Resolution ◽  
Land Surface ◽  
Amazon Basin ◽  
Near Infrared ◽  
Processing Technique ◽  
Image Processing Technique ◽  
Sar Data ◽  
Ocean Topography

Abstract A climatology of wetlands has been derived at a low spatial resolution (0.25° × 0.25° equal-area grid) over a 15-yr period by combining visible and near-infrared satellite observations and passive and active microwaves. The objective of this study is to develop a downscaling technique able to retrieve wetland estimations at a higher spatial resolution (about 500 m). The proposed method uses an image-processing technique applied to synthetic aperture radar (SAR) information about the low and high wetland season. This method is tested over the densely vegetated basin of the Amazon. The downscaling results are satisfactory since they respect the spatial hydrological features of the SAR data and the temporal evolution of the low-resolution wetland estimates. A new long-term and high-resolution wetland dataset has been generated for 1993–2007 for the Amazon basin. This dataset represents a new and unprecedented source of information for climate and land surface modeling of the Amazon and for the definition of future hydrology-oriented satellite missions such as Surface Water and Ocean Topography (SWOT).

High resolution thermal imaging inside integrated circuits

Sensor Review ◽  
2007 ◽  
Vol 27 (4) ◽  
pp. 291-297 ◽  
Author(s):  
G. Tessier ◽  
M. Bardoux ◽  
C. Filloy ◽  
C. Boué ◽  
D. Fournier
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Thermal Imaging

Mapping and Monitoring of the Land Use/Cover Changes in the Wider Area of ltanos, Crete, Using Very High Resolution EO Imagery With Specific Interest in Archaeological Sites

2019 ◽  
Author(s):  
Sawyer Reid stippa ◽  
George Petropoulos ◽  
Leonidas Toulios ◽  
Prashant K. Srivastava
Keyword(s):  
High Resolution ◽  
Spatial Resolution ◽  
Satellite Images ◽  
Archaeological Site ◽  
Digital Photography ◽  
Archaeological Sites ◽  
Large Area ◽  
High Resolution Imagery ◽  
Site Mapping ◽  
Rule Sets

Archaeological site mapping is important for both understanding the history as well as protecting them from excavation during the developmental activities. As archaeological sites generally spread over a large area, use of high spatial resolution remote sensing imagery is becoming increasingly applicable in the world. The main objective of this study was to map the land cover of the Itanos area of Crete and of its changes, with specific focus on the detection of the landscape’s archaeological features. Six satellite images were acquired from the Pleiades and WorldView-2 satellites over a period of 3 years. In addition, digital photography of two known archaeological sites was used for validation. An Object Based Image Analysis (OBIA) classification was subsequently developed using the five acquired satellite images. Two rule-sets were created, one using the standard four bands which both satellites have and another for the two WorldView-2 images their four extra bands included. Validation of the thematic maps produced from the classification scenarios confirmed a difference in accuracy amongst the five images. Comparing the results of a 4-band rule-set versus the 8-band showed a slight increase in classification accuracy using extra bands. The resultant classifications showed a good level of accuracy exceeding 70%. Yet, separating the archaeological sites from the open spaces with little or no vegetation proved challenging. This was mainly due to the high spectral similarity between rocks and the archaeological ruins. The satellite data spatial resolution allowed for the accuracy in defining larger archaeological sites, but still was a difficulty in distinguishing smaller areas of interest. The digital photography data provided a very good 3D representation for the archaeological sites, assisting as well in validating the satellite-derived classification maps. All in all, our study provided further evidence that use of high resolution imagery may allow for archaeological sites to be located, but only where they are of a suitable size archaeological features.

A Working Method for Adapting the (SEM) Scanning Electron Microscope to Produce (STEM) Scanning Transmission Electron Microscope Images

2002 ◽  
Author(s):  
Edward Coyne
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Theoretical Idea ◽  
Cross Sectional ◽  
Additional Advantage ◽  
Transmission Electron ◽  
Resolution Element ◽  
Scanning Electron

Abstract This paper describes the problems encountered and solutions found to the practical objective of developing an imaging technique that would produce a more detailed analysis of IC material structures then a scanning electron microscope. To find a solution to this objective the theoretical idea of converting a standard SEM to produce a STEM image was developed. This solution would enable high magnification, material contrasting, detailed cross sectional analysis of integrated circuits with an ordinary SEM. This would provide a practical and cost effective alternative to Transmission Electron Microscopy (TEM), where the higher TEM accelerating voltages would ultimately yield a more detailed cross sectional image. An additional advantage, developed subsequent to STEM imaging was the use of EDX analysis to perform high-resolution element identification of IC cross sections. High-resolution element identification when used in conjunction with high-resolution STEM images provides an analysis technique that exceeds the capabilities of conventional SEM imaging.

Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits

1999 ◽  
Author(s):  
Kenneth Krieg ◽  
Richard Qi ◽  
Douglas Thomson ◽  
Greg Bridges
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Real Time ◽  
High Speed ◽  
Time Signal ◽  
Surface Imaging ◽  
Atomic Force ◽  
Submicron Structures ◽  
High Resolution Images ◽  
Capacitive Loading

Abstract A contact probing system for surface imaging and real-time signal measurement of deep sub-micron integrated circuits is discussed. The probe fits on a standard probe-station and utilizes a conductive atomic force microscope tip to rapidly measure the surface topography and acquire real-time highfrequency signals from features as small as 0.18 micron. The micromachined probe structure minimizes parasitic coupling and the probe achieves a bandwidth greater than 3 GHz, with a capacitive loading of less than 120 fF. High-resolution images of submicron structures and waveforms acquired from high-speed devices are presented.

High Resolution Current Imaging by Direct Magnetic Field Sensing

2003 ◽  
Author(s):  
S.I. Woods ◽  
Nesco M. Lettsome ◽  
A.B. Cawthorne ◽  
L.A. Knauss ◽  
R.H. Koch
Keyword(s):  
Magnetic Field ◽  
High Resolution ◽  
Spatial Resolution ◽  
Great Promise ◽  
Magnetoresistive Sensor ◽  
Magnetic Sensitivity ◽  
Current Lines ◽  
Scanning Squid ◽  
Scanning Fiber ◽  
Ferromagnetic Probe

Abstract Two types of magnetic microscopes have been investigated for use in high resolution current mapping. The scanning fiber/SQUID microscope uses a SQUID sensor coupled to a nanoscale ferromagnetic probe, and the GMR microscope employs a nanoscale giant magnetoresistive sensor. Initial scans demonstrate that these microscopes can resolve current lines less than 10 µm apart with edge resolution of 1 µm. These types of microscopes are compared with the performance of a standard scanning SQUID microscope and with each other with respect to spatial resolution and magnetic sensitivity. Both microscopes show great promise for identifying current defects in die level devices.

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