Silicon nitride films grown on silicon below 300 °C in low power nitrogen plasma

1986 ◽  
Vol 49 (2) ◽  
pp. 97-99 ◽  
Author(s):  
E. Paloura ◽  
K. Nauka ◽  
J. Lagowski ◽  
H. C. Gatos
2014 ◽  
Vol 551 ◽  
pp. 120-126 ◽  
Author(s):  
M. Braccini ◽  
F. Volpi ◽  
A. Devos ◽  
G. Raymond ◽  
D. Benoit ◽  
...  

2016 ◽  
Vol 294 ◽  
pp. 194-200 ◽  
Author(s):  
D.Q. Shi ◽  
W. Xu ◽  
C.Y. Miao ◽  
C.Y. Ma ◽  
C.S. Ren ◽  
...  

2011 ◽  
Vol 29 (4) ◽  
pp. 041513 ◽  
Author(s):  
Pierre Morin ◽  
Gaetan Raymond ◽  
Daniel Benoit ◽  
Denis Guiheux ◽  
Roland Pantel ◽  
...  

1998 ◽  
Vol 508 ◽  
Author(s):  
A. Izumi ◽  
T. Ichise ◽  
H. Matsumura

AbstractSilicon nitride films prepared by low temperatures are widely applicable as gate insulator films of thin film transistors of liquid crystal displays. In this work, silicon nitride films are formed around 300 °C by deposition and direct nitridation methods in a catalytic chemical vapor deposition system. The properties of the silicon nitride films are investigated. It is found that, 1) the breakdown electric field is over 9MV/cm, 2) the surface state density is about 1011cm−2eV−1 are observed in the deposition films. These result shows the usefulness of the catalytic chemical vapor deposition silicon nitride films as gate insulator material for thin film transistors.


1978 ◽  
Vol 9 (28) ◽  
Author(s):  
T. ITO ◽  
S. HIJIYA ◽  
T. NOZAKI ◽  
H. ARAKAWA ◽  
M. SHINODA ◽  
...  

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