Impurity toroidal rotation profile measurement using upgraded high-resolution visible spectroscopic diagnostic on ADITYA-U tokamak

2021 ◽  
Vol 92 (6) ◽  
pp. 063517
Author(s):  
G. Shukla ◽  
M. B. Chowdhuri ◽  
K. Shah ◽  
R. Manchanda ◽  
N. Ramaiya ◽  
...  
Keyword(s):  
High Resolution ◽  
Profile Measurement ◽  
Toroidal Rotation

scholarly journals High resolution transmission grating spectrometer for edge toroidal rotation measurements of tokamak plasmas

2004 ◽  
Vol 75 (10) ◽  
pp. 4165-4167 ◽  
Author(s):  
A. Graf ◽  
M. May ◽  
P. Beiersdorfer ◽  
E. Magee ◽  
M. Lawrence ◽  
...  
Keyword(s):  
High Resolution ◽  
Tokamak Plasmas ◽  
Toroidal Rotation ◽  
Transmission Grating ◽  
Grating Spectrometer

Impurity ion temperature and toroidal rotation velocity in JET from high‐resolution x‐ray and XUV spectroscopy

1988 ◽  
Vol 64 (7) ◽  
pp. 3345-3352 ◽  
Author(s):  
M. Mattioli ◽  
J. Ramette ◽  
B. Saoutic ◽  
B. Denne ◽  
E. Källne ◽  
...  
Keyword(s):  
High Resolution ◽  
Rotation Velocity ◽  
Ion Temperature ◽  
X Ray ◽  
Toroidal Rotation ◽  
Xuv Spectroscopy ◽  
Impurity Ion

scholarly journals The Texas High-Precision Radial-velocity Programs

1999 ◽  
Vol 170 ◽  
pp. 113-120
Author(s):  
William D. Cochran ◽  
Artie P. Hatzes
Keyword(s):  
High Resolution ◽  
Radial Velocity ◽  
High Precision ◽  
Line Profile ◽  
Planetary Systems ◽  
Profile Measurement ◽  
European Southern Observatory ◽  
University Of Texas ◽  
The University ◽  
Search Program

AbstractSeveral different high-precision radial-velocity programs are now underway at The University of Texas. This paper discusses the aspects of these programs that are related to the problem of detection of extrasolar planetary systems. This includes the McDonald Observatory Planetary Search program on the McDonald 2.7-m Harlan Smith Telescope, an accompanying program of high-resolution stellar line profile measurement, the European Southern Observatory planetary search program, the Keck Hyades survey, and the Hobby∙Eberly Telescope planet surveys. Here, we summarize each of these programs, and present recent results from each.

HIGH RESOLUTION, REAL-TIME LINE-FIELD FOURIER-DOMAIN INTERFEROMETRY

2012 ◽  
Vol 05 (02) ◽  
pp. 1250009
Author(s):  
QING XIAO ◽  
LING FU
Keyword(s):  
High Resolution ◽  
Real Time ◽  
Reconstruction Algorithm ◽  
Profile Measurement ◽  
Fourier Domain ◽  
Processing Unit ◽  
Line Field ◽  
Cross Sectional ◽  
Interferometric Method ◽  
The Cross

To increase the application potential in manufacturing process, such as monitoring the processing performance, the profile measurement should be provided in real-time display and with high resolution simultaneously. We propose a line-field Fourier-domain interferometric method (LFI), which combines the line-field microscope with spectral interferometer, for the surface cross-sectional profile measurement with no scan needed. The white light and objectives are employed to offer high axial and lateral resolution, respectively. In our system setup, the measurement could be implemented in real-time display of 10 frame/s, and the resolutions of the LFI system in X,Y, and Z directions are ~8 μm, ~3.2 μm, and ~1.4 μm, respectively. As a demonstration, the cross-sectional profiles of a microfluidic chip are tested. The graphics processing unit is also used to accelerate the reconstruction algorithm to achieve the real-time display of the cross-sectional profiles.

Design of Digital Filters for Si Wafer Surface Profile Measurement - Denoising by Total Variation

2012 ◽  
Vol 516 ◽  
pp. 332-336
Author(s):  
Hirotaka Ojima ◽  
Kazutaka Nonomura ◽  
Li Bo Zhou ◽  
Jun Shimizu ◽  
Teppei Onuki
Keyword(s):  
High Resolution ◽  
Spatial Frequency ◽  
Frequency Domain ◽  
Total Variation ◽  
Digital Filters ◽  
Measured Data ◽  
Design Rule ◽  
Profile Measurement ◽  
Amplitude Component ◽  
Spatial Frequency Domain

In the semiconductor industry, high resolution and high accuracy measurement is needed for the geometric evaluation of Si wafers. The flatness parameters are important to evaluate the wafer profile and are required to be the same level as the design rule of IC, and the tolerance for flatness is very tight. According to SEMI (Semiconductor Equipment and Materials International) standards, the required wafer flatness will be 22 nanometres by the year 2016. However, to obtain a higher resolution for sensors, the uncertainty becomes very large compared to the resolution and influences the measured data when the noise is increased. High resolution instruments always incorporate a certain degree of noise. In the presence of noise, form parameters are normally biased. Correction and compensation need a large population of measurements to analytically estimate both bias and uncertainty. The estimation is still far from perfect because of the nature of noise. Another approach is to extract a true profile by filtering noise from the measured data. For the purpose of noise reduction, low-pass filters by Gaussian smoothing and Fourier transform are often used. The noise is normally considered to be a component of small deviation (amplitude) with high frequency which also takes a normal distribution around zero. However these conventional filters can remove the noise in the spatial frequency domain only. So, it is essential to design a filter capable of removing the noise both in the spatial frequency domain and the amplitude component. Thus, we have designed and developed new type of digital filter for denoising. We introduce two new digital filters. One is wavelet transform capable of denoising in the spatial frequency domain and amplitude component, and the other is total variation that can be applied to discontinuous signals without introducing artificial Gibbs Effects.

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