Effect of sodium dodecyl sulphate on Cu electrodeposition: interaction with hydrophobic substrate and Cu ions
2018 ◽
Vol 10
(6)
◽
pp. 06013-1-06013-5
◽
2000 ◽
Vol 742
(2)
◽
pp. 421-426
◽
2012 ◽
Vol 178-181
◽
pp. 609-612
1970 ◽
Vol 37
(2)
◽
pp. 259-267
◽
Keyword(s):
1998 ◽
Vol 118
(2)
◽
pp. 111-122
◽