Application of the Island Blister Test for Thin Film Adhesion Measurement

1989 ◽  
Vol 29 (1-4) ◽  
pp. 219-231 ◽  
Author(s):  
Mark G. Allen ◽  
Stephen D. Senturia
Keyword(s):  
Thin Film ◽  
Blister Test ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion

Thin Film Adhesion Study in Microelectronic Packaging

1991 ◽  
Vol 239 ◽  
Author(s):  
H. S. Jeong ◽  
Y. Z. Chu ◽  
M. B. Freiler ◽  
C. Durning ◽  
R. C. White
Keyword(s):  
Thin Film ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Microelectronic Packaging ◽  
Elastic Model ◽  
Blister Test ◽  
Linear Elastic ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Cure Temperature

ABSTRACTFracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

2006 ◽  
Vol 88 (19) ◽  
pp. 191911 ◽  
Author(s):  
V. Kireev ◽  
Y. Liu ◽  
Y. Braiman ◽  
B. Radhakrishnan ◽  
C. H. Hsueh ◽  
...  
Keyword(s):  
Thin Film ◽  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
High Power ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion

Recent Developments in Thin Film Adhesion Measurement

2004 ◽  
Vol 4 (2) ◽  
pp. 163-168 ◽  
Author(s):  
M.J. Cordill ◽  
D.F. Bahr ◽  
N.R. Moody ◽  
W.W. Gerberich
Keyword(s):  
Thin Film ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Film Adhesion ◽  
Recent Developments

Investigation of a new fracture mechanics specimen for thin film adhesion measurement

1997 ◽  
Vol 12 (10) ◽  
pp. 2673-2685 ◽  
Author(s):  
Maarten P. de Boer ◽  
Michael Kriese ◽  
William W. Gerberich
Keyword(s):  
Thin Film ◽  
Fracture Mechanics ◽  
Integrated Circuit ◽  
Carbon Layer ◽  
Tangential Load ◽  
Film Adhesion ◽  
Adhesion Measurement ◽  
Thin Carbon ◽  
Thin Film Adhesion ◽  
Processing Techniques

We have investigated mechanical probing of a precracked fine line structure as a new type of thin film fracture mechanics specimen. An idealized mechanics analysis is first presented. Experimentally, two types of precracks are formed. A thin carbon layer to which other layers weakly adhere creates a “processed precrack” by integrated circuit processing techniques. An “indented processed precrack” is formed by precision alignment of a sharp microwedge. The processed precrack is found to reduce the critical tangential load by 50% from a non-precracked line, while the indented processed precrack lowers the load by 200%. From this, a reasonable value of adhesion may be directly calculated. Crack path behavior is observed to depend on strength of the interface. In the case of a weak interface, the crack remains in the interface as it extends. For a strong interface, it kinks into the substrate if the crack is initially short, but remains in the interface if it is initially long. Given the experimental evidence, the mechanics are slightly modified to quantitatively model the experimental data.

One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

2018 ◽  
Vol 85 (5) ◽  
Author(s):  
Tingting Zhu ◽  
Sinan Müftü ◽  
Kai-tak Wan
Keyword(s):  
Thin Film ◽  
Contact Area ◽  
Interfacial Adhesion ◽  
External Pressure ◽  
Adhesion Energy ◽  
Blister Test ◽  
One Dimensional ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Interfacial Adhesion Energy

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w0, above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w0, c) is established for a fixed interfacial adhesion energy.

scholarly journals Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

2017 ◽  
Vol 84 (7) ◽  
Author(s):  
Tingting Zhu ◽  
Guangxu Li ◽  
Sinan Müftü ◽  
Kai-tak Wan
Keyword(s):  
Thin Film ◽  
Solid Mechanics ◽  
Small Strain ◽  
Adhesion Energy ◽  
Deformation Model ◽  
Uniform Pressure ◽  
Blister Test ◽  
Mechanics Model ◽  
Film Adhesion ◽  
Thin Film Adhesion

A thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the nondeformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and “pull-off” or spontaneous detachment from the plate. Simultaneous measurement of (p, w0, c) allows one to determine the adhesion energy, γ. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading–unloading hysteresis. The results are consistent with a large deformation model in the literature.

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