Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique

1997 ◽  
Vol 76 (3) ◽  
pp. 259-272 ◽  
Author(s):  
R. Martins ◽  
A. Maçarico ◽  
I. Ferreira ◽  
J. Fidalgo ◽  
E. Fortunato
Keyword(s):  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Deposition Technique ◽  
Deposition Parameters ◽  
Chemical Vapour Deposition Technique

Synthesis of Large Carbon Nanotubes from Ferrocene: The Chemical Vapour Deposition Technique

2011 ◽  
Vol 6 (11) ◽  
pp. 1270-1279 ◽  
Author(s):  
Clarence S. Yah ◽  
Geoffrey S. Simate ◽  
Kapil Moothi ◽  
Kwena S. Maphutha ◽  
Sunny E. Iyuke
Keyword(s):  
Carbon Nanotubes ◽  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Deposition Technique ◽  
Chemical Vapour Deposition Technique

XRD Studies on Residual Stress of the Diamond Films Grown Using Hot Filament Chemical Vapour Deposition Technique on Silicon Nitride and Tungsten Carbide Substrates

2013 ◽  
Vol 686 ◽  
pp. 325-330 ◽  
Author(s):  
Esah Hamzah ◽  
Tze Mi Yong ◽  
Kevin Chee Mun Fai
Keyword(s):  
Residual Stress ◽  
Silicon Nitride ◽  
Tungsten Carbide ◽  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Diamond Films ◽  
Chemical Vapour ◽  
Deposition Technique ◽  
Chemical Vapour Deposition Technique ◽  
Hot Filament

This study analyses residual stress measurement using X-Ray diffraction method on ultrafine-polycrystalline diamonds and polycrystalline diamonds films grown using Hot Filament Chemical Vapour Deposition technique (HFCVD) on silicon nitride(Si3N4) and tungsten carbide (WC) substrates in the same chamber at the same time with varied pretreatments prior to HFCVD diamond deposition. Measurements were taken perpendicular to the surface and the measured residual stress states of the diamond films are in compression. Thus, assuming isotropic properties of the film, the diamond films grown have tension residual stress parallel to the surface of the substrate. Residual stress is estimated to have the lowest stress for substrate that has undergone 5g/liter silicon carbide seeding process. Effects of residual stress to adhesion are discussed for both substrates.

Electrochemical sensing of nitrite using a copper–titanium oxide composite derived from a hexanuclear complex

RSC Advances ◽  
2016 ◽  
Vol 6 (33) ◽  
pp. 27852-27861 ◽  
Author(s):  
Muhammad Ali Ehsan ◽  
Rabia Naeem ◽  
Vickie McKee ◽  
Abbas Hakeem Saeed ◽  
Alagarsamy Pandikumar ◽  
...  
Keyword(s):  
Titanium Oxide ◽  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Electrochemical Sensing ◽  
Deposition Technique ◽  
Oxide Composite ◽  
Molecular Precursor ◽  
Chemical Vapour Deposition Technique ◽  
Hexanuclear Complex

An electrochemical nitrite ions sensor electrode, CuO–2TiO2, has been developed using single molecular precursor [Cu2Ti4(O)2(OH)4(TF)8(THF)6]·THF in aerosol assisted chemical vapour deposition technique.

Sign in / Sign up

Export Citation Format

Share Document