A Honeycomb Microchannel Cooling System for Microelectronics Cooling

2011 ◽  
Vol 32 (7-8) ◽  
pp. 616-623 ◽  
Author(s):  
Xiaobing Luo ◽  
Yonglu Liu ◽  
Wei Liu
2013 ◽  
Vol 10 (1) ◽  
pp. 40-47 ◽  
Author(s):  
Aparna Aravelli ◽  
Singiresu S. Rao ◽  
Hari K. Adluru

Increased heat generation in semiconductor devices for demanding applications leads to the investigation of highly efficient cooling solutions. Effective options for thermal management include passing of cooling liquid through the microchannel heat sink and using highly conductive materials. In the author's previous work, experimental and computational analyses were performed on LTCC substrates using embedded silver vias and silver columns forming microchannels. This novel technique of embedding silver vias along with forced convection using a coolant resulted in higher heat transfer rates. The present work investigates the design optimization of this cooling system (microheat exchanger) using systems optimization theory. A new multiobjective optimization problem was formulated for the heat transfer in the LTCC model using the log mean temperature difference (LMTD) method of heat exchangers. The goal is to maximize the total heat transferred and to minimize the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Pressure loss and volume of the silver metal are used as constraints. A hybrid optimization technique using sequential quadratic programming (SQP) and branch and bound method of integer programming has been developed to solve the microheat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.


Author(s):  
Tom Saenen ◽  
Martine Baelmans

A one dimensional dynamic system model is developed to accurately simulate a two-phase microchannel electronics cooling loop. This model is based on the single component mixture equations for mass, momentum and energy. These equations are solved numerically using a finite volume method in conjunction with the SIMPLE algorithm. To calculate the pressure losses and heat transfer state of the art empirical correlations are used. Furthermore size effects of a typical microchannel cooling system are investigated with the new model. Special attention is given to the accumulator size and its limitations for portable applications. A simple model to investigate the accumulator size effect on the loop is developed and compared to numerical results obtained from the system model. The influence of various loop parameters and possible improvements are also investigated. Finally the effect of using different coolants is studied.


Author(s):  
Manoj Siva ◽  
Arvind Pattamatta ◽  
Sarit Kumar Das

A common assumption in basic heat exchanger design theory is that fluid is distributed uniformly at the inlet of the exchanger on each fluid side and throughout the core. However in reality, uniform flow distribution is never achieved in a heat exchanger and is referred to as flow maldistribution. Flow maldistribution is generally well understood for the macrochannel system. But it is still unclear whether the assumptions underlying the flow distribution in conventional macrochannel heat exchangers hold good for microchannel system. In this regard, extensive numerical simulations are carried out in a ‘U’ type parallel micro-channel system in order to study flow and heat transfer maldistribution and validated with in-house experimental data. A detailed parametric analysis is carried out to characterize flow maldistribution in a microchannel system and to study the effect of geometrical factors such as number of channels, n, Area of cross section of the channel Ac, manifold cross section area Ap, and flow parameter such as Reynolds number, Re, on the pressure and temperature distribution. In order to minimize the variation in pressure and to reduce temperature hot spots in the microchannel, a Response surface based surrogate approximation (RSA) and a gradient based search algorithm are used to arrive at the best configuration of microchannel cooling system. A three level factorial design involving three parameters namely Ac/Ap, Re, n are considered. The results from the optimization indicate that the case of n = 5, Ac/Ap = 0.12, and Re = 100 is the best possible configuration to alleviate flow maldistribution and hotspot formation in microchannel cooling system.


Author(s):  
Tushara Pasupuleti ◽  
Satish G. Kandlikar

An approach towards practical application of microchannel cooling system is necessary as the demand of high power density devices is increasing. Colgan et. al. [1] have designed a unit known as Single Chip Module (SCM) by considering the practical issues for packaging a microchannel cooling system with a microelectronic device. The performance of the SCM has already been investigated by using water as working fluid by Colgan et. al. [1]. Considering the actual working conditions, water cannot be used in electronic devices as the working fluid because any leakage may lead to system damage. Alternative fluids like refrigerants were considered. In this research, the performance of SCM has been studied by using refrigerant R-123 as working fluid and compared with water cooled system. Cooling of 83.33 W/cm2 has been achieved for a powered area of 3 cm2 by maintaining chip temperature of 60°C. The heat transfer co-efficient obtained at a flowrate of 0.7 lpm was 34.87 kW/m2-K. The results obtained indicate that from a thermal viewpoint, R-123 can be considered as working fluid for microelectronic cooling devices.


Author(s):  
V. Manoj Siva ◽  
Arvind Pattamatta ◽  
Sarit Kumar Das

A common assumption in basic heat exchanger design theory is that fluid is distributed uniformly at the inlet of the exchanger on each fluid side and throughout the core. However, in reality, uniform flow distribution is never achieved in a heat exchanger and is referred to as flow maldistribution. Flow maldistribution is generally well understood for the macrochannel system. But it is still unclear whether the assumptions underlying the flow distribution in conventional macrochannel heat exchangers hold good for microchannel system. In this regard, extensive numerical simulations are carried out in a “U” type parallel microchannel system in order to study flow and heat transfer maldistribution and validated with in-house experimental data. A detailed parametric analysis is carried out to characterize flow maldistribution in a microchannel system and to study the effect of geometrical factors such as number of channels, n, Area of cross section of the channel Ac, manifold cross section area Ap, and flow parameter such as Reynolds number, Re, on the pressure and temperature distribution. In order to minimize the variation in pressure and to reduce temperature hot spots in the microchannel, a response surface based surrogate approximation and a gradient based search algorithm are used to arrive at the best configuration of microchannel cooling system. A three level factorial design involving three parameters namely Ac/Ap, Re, n are considered. The results from the optimization indicate that the case of n = 7, Ac/Ap = 0.69, and Re = 100 is the best possible configuration to alleviate flow maldistribution and hotspot formation in microchannel cooling system.


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