Thermal Improvement in Double-Layered Microchannel Heat Sink with Incorporating Wavy Porous Fins

2021 ◽  
pp. 1-19
Author(s):  
Shahrokh Boland ◽  
Sahand Majidi
Keyword(s):  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Thermal Improvement ◽  
Porous Fins

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

scholarly journals Study on flow and heat transfer of liquid metal in a new top-slotted microchannel heat sink

2021 ◽  
Vol 621 ◽  
pp. 012054
Author(s):  
Zhiwei Chen ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Flow And Heat Transfer
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